Datasheet > MKG40RK600LB

MKG40RK600LB

更新时间： 2024-09-16 14:56:15

品牌	Logo	应用领域
力特 - LITTELFUSE		PC 光电二极管电源电路
页数	文件大小	规格书
5页	308K
描述
SMPD封装重仅8g，相比传统的电源模块更轻（通常要轻50%），因此可打造重量更轻的电源系统。由于外形小巧且采用小尺寸封装，因此可为多个器件采用同一个散热器，从而节省PCB空间。除了更小、更轻

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中文翻译

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数据手册

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MKG40RK600LB 数据手册

MKG 40RK600LB

I_D25

V_DSS

= 54A

= 600V

Buck / Boost Tpology

CoolMOS™ ¹⁾with fast SONIC Diode

R_{DS(on) max}= 41mW

ISOPLUS™ - electrically isolated surface to heatsink

Surface Mount Power Device

Part number

MKG40RK600LB

E72873

2x D

2x S

3x K

Features / Advantages:

Applications:

Package: SMPD

• Fast CoolMOS^{™ 1)}C6 MOSFET

- very low on-resistance

- low gate charge

- avalanche rated for unclamped

inductive switching (UIS)

• Buck / boost chopper

• PFC stage

• Forward converter

• isolated surface to heatsink

• low coupling capacity between pins

and heatsink

• PCB space saving

• enlarged creepage towards heatsink

• application friendly pinout

• low inductive current path

• high reliability

¹⁾CoolMOS^™is a trademark of

Inﬁneon Technologies AG.

IXYS reserves the right to change limits, test conditions and dimensions.

Data according ot IEC 60747 and per semiconductor unless otherwise speciﬁed

20131121

1 - 4

12 3 4 5

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