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MK70FX512VMJ12 PDF预览

MK70FX512VMJ12

更新时间: 2024-09-23 15:19:11
品牌 Logo 应用领域
恩智浦 - NXP 双倍数据速率
页数 文件大小 规格书
97页 1351K
描述
Kinetis® K70-120–150 MHz, High-Speed USB, Ethernet, DDR and Anti-Tamper Microc...

MK70FX512VMJ12 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:BGA
包装说明:17 X 17 MM, MAPBGA-256针数:256
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.74
Samacsys Description:NXP MK70FX512VMJ12, 32bit ARM Cortex M4 MCU, 120MHz, 1 MB Flash, 256-Pin MAPBGA具有ADC:YES
其他特性:ALSO OPERATES AT 1 V MINIMUM SUPPLY地址总线宽度:
位大小:32CPU系列:CORTEX-M4F
最大时钟频率:32 MHzDAC 通道:YES
DMA 通道:YES外部数据总线宽度:
JESD-30 代码:S-PBGA-B256长度:17 mm
湿度敏感等级:3I/O 线路数量:132
端子数量:256最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA256,16X16,40封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE峰值回流温度(摄氏度):260
电源:1.8/3.3 V认证状态:Not Qualified
RAM(字节):131072ROM(单词):524288
ROM可编程性:FLASH座面最大高度:1.7 mm
速度:120 MHz子类别:Microcontrollers
最大压摆率:177 mA最大供电电压:3.6 V
最小供电电压:1.71 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper - with Nickel barrier
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:17 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MK70FX512VMJ12 数据手册

 浏览型号MK70FX512VMJ12的Datasheet PDF文件第2页浏览型号MK70FX512VMJ12的Datasheet PDF文件第3页浏览型号MK70FX512VMJ12的Datasheet PDF文件第4页浏览型号MK70FX512VMJ12的Datasheet PDF文件第5页浏览型号MK70FX512VMJ12的Datasheet PDF文件第6页浏览型号MK70FX512VMJ12的Datasheet PDF文件第7页 
Document Number K70P256M120SF3  
Rev. 7, 02/2018  
NXP Semiconductors  
Data Sheet: Technical Data  
K70P256M120SF3  
K70 Sub-Family  
Supports the following:  
MK70FX512VMJ12,  
MK70FN1M0VMJ12  
Key features  
• Security and integrity modules  
– Hardware CRC module to support fast cyclic  
redundancy checks  
– Tamper detect and secure storage  
– Hardware random-number generator  
– Hardware encryption supporting DES, 3DES, AES,  
MD5, SHA-1, and SHA-256 algorithms  
– 128-bit unique identification (ID) number per chip  
• Operating Characteristics  
– Voltage range: 1.71 to 3.6 V  
– Flash write voltage range: 1.71 to 3.6 V  
– Temperature range (ambient): -40 to 105°C  
• Performance  
– Up to 120 MHz Arm® Cortex®-M4 core with DSP  
instructions delivering 1.25 Dhrystone MIPS per  
MHz  
• Human-machine interface  
– Graphic LCD controller  
• Memories and memory interfaces  
– Up to 1024 KB program flash memory on non-  
FlexMemory devices  
– Low-power hardware touch sensor interface (TSI)  
– General-purpose input/output  
• Analog modules  
– Up to 512 KB program flash memory on  
FlexMemory devices  
– Up to 512 KB FlexNVM on FlexMemory devices  
– 16 KB FlexRAM on FlexMemory devices  
– Up to 128 KB RAM  
– Serial programming interface (EzPort)  
– FlexBus external bus interface  
– DDR controller interface  
– Four 16-bit SAR ADCs  
– Programmable gain amplifier (PGA) (up to x64)  
integrated into each ADC  
– Two 12-bit DACs  
– Four analog comparators (CMP) containing a 6-bit  
DAC and programmable reference input  
– Voltage reference  
– NAND flash controller interface  
• Timers  
– Programmable delay block  
– Two 8-channel motor control/general purpose/PWM  
timers  
– Two 2-channel quadrature decoder/general purpose  
timers  
• Clocks  
– 3 to 32 MHz crystal oscillator  
– 32 kHz crystal oscillator  
– Multi-purpose clock generator  
• System peripherals  
– IEEE 1588 timers  
– Multiple low-power modes to provide power  
optimization based on application requirements  
– Memory protection unit with multi-master  
protection  
– Periodic interrupt timers  
– 16-bit low-power timer  
– Carrier modulator transmitter  
– Real-time clock  
– 32-channel DMA controller, supporting up to 128  
request sources  
– External watchdog monitor  
– Software watchdog  
– Low-leakage wakeup unit  
NXP reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  

MK70FX512VMJ12 替代型号

型号 品牌 替代类型 描述 数据表
MK70FX512VMJ15 NXP

类似代替

Kinetis® K70-120–150 MHz, High-Speed USB, Ethernet, DDR and Anti-Tam

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