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MK20DN512VMC10 PDF预览

MK20DN512VMC10

更新时间: 2024-11-27 15:18:27
品牌 Logo 应用领域
恩智浦 - NXP 微控制器
页数 文件大小 规格书
80页 1791K
描述
Kinetis® K20-100 MHz, Full-Speed USB, Mixed-Signal Integration Microcontrollers base...

MK20DN512VMC10 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:BGA
包装说明:8 X 8 MM, MAPBGA-121针数:121
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.68
具有ADC:YES地址总线宽度:
位大小:32CPU系列:CORTEX-M4
最大时钟频率:32 MHzDAC 通道:YES
DMA 通道:YES外部数据总线宽度:
JESD-30 代码:S-PBGA-B121长度:8 mm
湿度敏感等级:3I/O 线路数量:81
端子数量:121最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA121,11X11,25封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:1.8/3.3 V认证状态:Not Qualified
RAM(字节):131072ROM(单词):524288
ROM可编程性:FLASH座面最大高度:1.52 mm
速度:100 MHz子类别:Microcontrollers
最大压摆率:77 mA最大供电电压:3.6 V
最小供电电压:1.71 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper - with Nickel barrier
端子形式:BALL端子节距:0.65 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:8 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MK20DN512VMC10 数据手册

 浏览型号MK20DN512VMC10的Datasheet PDF文件第2页浏览型号MK20DN512VMC10的Datasheet PDF文件第3页浏览型号MK20DN512VMC10的Datasheet PDF文件第4页浏览型号MK20DN512VMC10的Datasheet PDF文件第5页浏览型号MK20DN512VMC10的Datasheet PDF文件第6页浏览型号MK20DN512VMC10的Datasheet PDF文件第7页 
Document Number: K20P121M100SF2V2  
Rev. 3, 6/2013  
Freescale Semiconductor  
Data Sheet: Technical Data  
K20P121M100SF2V2  
K20 Sub-Family  
Supports the following:  
MK20DX256VMC10,  
MK20DN512VMC10  
Features  
Human-machine interface  
– Low-power hardware touch sensor interface (TSI)  
– General-purpose input/output  
Operating Characteristics  
– Voltage range: 1.71 to 3.6 V  
– Flash write voltage range: 1.71 to 3.6 V  
– Temperature range (ambient): -40 to 105°C  
Analog modules  
– Two 16-bit SAR ADCs  
– Programmable gain amplifier (PGA) (up to x64)  
integrated into each ADC  
– Two 12-bit DACs  
– Two transimpedance amplifiers  
– Three analog comparators (CMP) containing a 6-bit  
DAC and programmable reference input  
– Voltage reference  
Performance  
– Up to 100 MHz ARM Cortex-M4 core with DSP  
instructions delivering 1.25 Dhrystone MIPS per  
MHz  
Memories and memory interfaces  
– Up to 512 KB program flash memory on non-  
FlexMemory devices  
– Up to 256 KB program flash memory on  
FlexMemory devices  
– Up to 256 KB FlexNVM on FlexMemory devices  
– 4 KB FlexRAM on FlexMemory devices  
– Up to 128 KB RAM  
Timers  
– Programmable delay block  
– Eight-channel motor control/general purpose/PWM  
timer  
– Two 2-channel quadrature decoder/general purpose  
timers  
– Periodic interrupt timers  
– 16-bit low-power timer  
– Carrier modulator transmitter  
– Real-time clock  
– Serial programming interface (EzPort)  
– FlexBus external bus interface  
Clocks  
– 3 to 32 MHz crystal oscillator  
– 32 kHz crystal oscillator  
– Multi-purpose clock generator  
Communication interfaces  
– USB full-/low-speed On-the-Go controller with on-  
chip transceiver  
System peripherals  
– Multiple low-power modes to provide power  
optimization based on application requirements  
– Memory protection unit with multi-master  
protection  
– Two Controller Area Network (CAN) modules  
– Three SPI modules  
– Two I2C modules  
– Six UART modules  
– Secure Digital host controller (SDHC)  
– I2S module  
– 16-channel DMA controller, supporting up to 63  
request sources  
– External watchdog monitor  
– Software watchdog  
– Low-leakage wakeup unit  
Security and integrity modules  
– Hardware CRC module to support fast cyclic  
redundancy checks  
– 128-bit unique identification (ID) number per chip  
Freescale reserves the right to change the detail specifications as may be  
required to permit improvements in the design of its products.  
© 2012–2013 Freescale Semiconductor, Inc.  

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