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MJK44H11TWG PDF预览

MJK44H11TWG

更新时间： 2024-11-21 11:14:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 1662K
描述
80 V, 8A, Low VCE(sat) NPN Transistor

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MJK44H11TWG 数据手册

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DATA SHEET  
www.onsemi.com  
Power Transistor 80 V, 8 A  
Dual General Purpose NPN  
NPN TRANSISTOR  
80 V, 8 A  
C5  
MJK44H11  
Designed for general purpose power and switching applications  
such as regulators, converters and power amplifiers. Housed  
in advanced LFPAK package (5 x 6 mm) with excellent thermal  
conduction. Automotive end applications include air bag deployment,  
power train control units, and instrument clusters.  
B 4  
E 123  
Features  
• Complementary NPN: MJK45H11  
• NJV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
LFPAK4 5x6  
CASE 760AB  
MARKING DIAGRAM  
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Value  
Unit  
Collector−Emitter Voltage  
V
80  
Vdc  
CEO  
EBO  
4H11G  
ALLYW  
Emitter−Base Voltage  
V
5
Vdc  
A
Collector Current − Continuous  
Collector Current − Peak  
I
C
8
16  
I
A
CM  
Junction and Storage Temperature Range  
T , T  
−65 to +150  
_C  
J
stg  
4H11G  
A
LL  
Y
= Specific Device Code  
= Assembly Location  
= Wafer Lot  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
= Year  
W
= Work Week  
THERMAL CHARACTERISTICS  
Characteristics  
Symbol  
Max  
Unit  
ORDERING INFORMATION  
Thermal Resistance, Junction−to−Ambient  
per Device (Note 1)  
R
6
_C/W  
q
JC  
†
Device  
Package  
Shipping  
Thermal Resistance, Junction−to−Ambient  
R
70  
20  
_C/W  
q
JA  
LFPAK4 5x6 3000 / Tape &  
MJK44H11TWG  
per Device (Note 1)  
(Pb−Free)  
NJVMJK44H11TWG LFPAK4 5x6 3000 / Tape &  
Reel  
Total Power Dissipation per Device  
P
W
D
@ T = 25_C (Note 1)  
A
(Pb−Free)  
Reel  
2
1. Surface−mounted on FR4 board using a 1in , 2 oz. Cu pad  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
September, 2022 − Rev. 0  
MJK44H11/D  
 
123456

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