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MJK31CTWG

更新时间： 2024-11-21 11:15:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 1680K
描述
Power Transistor 100 V, 3 A Dual General Purpose NPN

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MJK31CTWG 数据手册

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DATA SHEET  
www.onsemi.com  
Power Transistor, NPN, Dual  
General Purpose  
100 V, 3 A  
NPN TRANSISTOR  
100 V, 3 A  
C5  
MJK31C  
These Bipolar Junction Transistors are designed for general purpose  
power and switching applications such as regulators, converters  
and power amplifiers. Housed in advanced LFPAK package  
(5 x 6 mm) with excellent thermal conduction. Automotive  
end applications include air bag deployment, power train control  
units, and instrument clusters.  
B 4  
E 123  
Features  
• Complementary PNP: MJK32C  
• NJV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
LFPAK4 5x6  
CASE 760AB  
MARKING DIAGRAM  
J31CG  
XX  
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Max  
Unit  
ALLYW  
Collector−Emitter Voltage  
V
100  
Vdc  
CEO  
EBO  
Emitter−Base Voltage  
V
5
Vdc  
A
1
2
3
4
(Top View)  
Collector Current − Continuous  
Collector Current − Peak  
I
C
3
J31CG  
A
LL  
Y
= Specific Device Code  
= Assembly Location  
= Wafer Lot  
I
5
A
CM  
Junction and Storage Temperature Range  
T , T  
−65 to +150  
_C  
J
stg  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
= Year  
W
= Work Week  
ORDERING INFORMATION  
THERMAL CHARACTERISTICS  
†
Device  
Package  
Shipping  
Characteristics  
Symbol  
Max  
Unit  
Thermal Resistance, Junction−to−Case  
R
2.4  
_C/W  
q
MJK31CTWG  
LFPAK4 5x6 3000 / Tape &  
JC  
JA  
D
per Device (Note 1)  
(Pb−Free)  
Reel  
Thermal Resistance, Junction−to−Ambient  
per Device (Note 1)  
R
45  
_C/W  
LFPAK4 5x6 3000 / Tape &  
q
NJVMJK31CTWG  
(Pb−Free)  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Total Power Dissipation  
P
2.7  
W
@ T = 25_C (Note 1)  
A
2
1. Surface−mounted on FR4 board using a 6 cm , 2 oz. Cu collector pad.  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
April, 2022 − Rev. 0  
MJK31C/D  
 
123456

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