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MJD5731_11 PDF预览

MJD5731_11

更新时间: 2024-09-15 10:55:51
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
5页 114K
描述
High Voltage PNP Silicon Power Transistors

MJD5731_11 数据手册

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MJD5731  
High Voltage PNP Silicon  
Power Transistors  
Designed for line operated audio output amplifier,  
SWITCHMODEt power supply drivers and other switching  
applications.  
http://onsemi.com  
Features  
350 V (Min) V  
CEO(sus)  
SILICON  
POWER TRANSISTORS  
1.0 AMPERE  
1.0 A Rated Collector Current  
PNP Complements to the MJD47 thru MJD50 Series  
Epoxy Meets UL 94 V0 @ 0.125 in  
ESD Ratings: Human Body Model, 3B u 8000 V  
350 VOLTS, 15 WATTS  
Machine Model, C u 400 V  
These are PbFree Packages  
4
2
1
MAXIMUM RATINGS  
3
Rating  
CollectorEmitter Voltage  
EmitterBase Voltage  
Symbol  
Max  
350  
5
Unit  
Vdc  
Vdc  
Adc  
DPAK  
CASE 369C  
STYLE 1  
V
CEO  
V
EB  
I
C
1.0  
3.0  
Collector Current Continuous  
Peak  
MARKING DIAGRAM  
P
D
15  
0.12  
W
W/°C  
Total Power Dissipation @ T = 25°C  
C
Derate above 25°C  
AYWW  
J
5731G  
Total Power Dissipation (Note 1)  
P
D
W
@ T = 25°C  
1.56  
0.0125  
A
Derate above 25°C  
W/°C  
Unclamped Inductive Load Energy  
(See Figure 10)  
E
20  
mJ  
A
Y
= Assembly Location  
= Year  
= Work Week  
= Device Code  
= PbFree Package  
Operating and Storage Junction  
Temperature Range  
T , T  
55 to +150  
°C  
J
stg  
WW  
J5731  
G
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance, JunctiontoCase  
R
8.33  
°C/W  
q
JC  
ORDERING INFORMATION  
Thermal Resistance, JunctiontoAmbient  
R
80  
°C/W  
q
JA  
Device  
MJD5731T4G  
Package  
Shipping  
(Note 1)  
DPAK  
(PbFree)  
2500/Tape & Reel  
Lead Temperature for Soldering  
T
260  
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. These ratings are applicable when surface mounted on the minimum pad  
sizes recommended.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
January, 2011 Rev. 4  
MJD5731/D  
 

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