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MJD44H11_06 PDF预览

MJD44H11_06

更新时间: 2024-09-13 04:15:31
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
7页 76K
描述
Complementary Power Transistors

MJD44H11_06 数据手册

 浏览型号MJD44H11_06的Datasheet PDF文件第2页浏览型号MJD44H11_06的Datasheet PDF文件第3页浏览型号MJD44H11_06的Datasheet PDF文件第4页浏览型号MJD44H11_06的Datasheet PDF文件第5页浏览型号MJD44H11_06的Datasheet PDF文件第6页浏览型号MJD44H11_06的Datasheet PDF文件第7页 
MJD44H11 (NPN)  
MJD45H11 (PNP)  
Preferred Device  
Complementary Power  
Transistors  
DPAK For Surface Mount Applications  
http://onsemi.com  
Designed for general purpose power and switching such as output or  
driver stages in applications such as switching regulators, converters,  
and power amplifiers.  
SILICON  
POWER TRANSISTORS  
8 AMPERES  
Features  
Lead Formed for Surface Mount Application in Plastic Sleeves  
(No Suffix)  
80 VOLTS, 20 WATTS  
Straight Lead Version in Plastic Sleeves (“−1” Suffix)  
MARKING  
DIAGRAMS  
Electrically Similar to Popular D44H/D45H Series  
Low Collector Emitter Saturation Voltage −  
4
YWW  
J4  
xH11G  
V
CE(sat)  
= 1.0 Volt Max @ 8.0 Amperes  
Fast Switching Speeds  
2
1
Complementary Pairs Simplifies Designs  
Epoxy Meets UL 94 V−0 @ 0.125 in  
ESD Ratings: Human Body Model, 3B u 8000 V  
Machine Model, C u 400 V  
3
DPAK  
CASE 369C  
STYLE 1  
Pb−Free Packages are Available  
4
MAXIMUM RATINGS  
Rating  
Collector−Emitter Voltage  
Emitter−Base Voltage  
Symbol  
Max  
80  
5
Unit  
Vdc  
Vdc  
Adc  
YWW  
J4  
xH11G  
V
CEO  
V
EB  
1
2
Collector Current − Continuous  
− Peak  
I
8
16  
C
3
DPAK−3  
CASE 369D  
STYLE 1  
Total Power Dissipation  
P
W
D
D
@ T = 25°C  
20  
0.16  
C
Derate above 25°C  
W/°C  
Total Power Dissipation (Note 1)  
P
W
Y
WW  
=
=
=
Year  
1.75  
0.014  
@ T = 25°C  
A
Work Week  
Device Code  
x = 4 or 5  
W/°C  
°C  
Derate above 25°C  
J4xH11  
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
J
stg  
G
=
Pb−Free Package  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
6.25  
71.4  
Unit  
°C/W  
°C/W  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
Thermal Resistance, Junction−to−Case  
R
q
JC  
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
q
JA  
Lead Temperature for Soldering  
T
260  
°C  
Preferred devices are recommended choices for future use  
L
and best overall value.  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. These ratings are applicable when surface mounted on the minimum pad  
sizes recommended.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 7  
MJD44H11/D  
 

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Package / Case : TO-251;Mounting Style : Through Hole;Power Rating : 20 W;Transistor Polar