MJD44H11 (NPN)
MJD45H11 (PNP)
Preferred Device
Complementary Power
Transistors
DPAK For Surface Mount Applications
http://onsemi.com
Designed for general purpose power and switching such as output or
driver stages in applications such as switching regulators, converters,
and power amplifiers.
SILICON
POWER TRANSISTORS
8 AMPERES
Features
• Lead Formed for Surface Mount Application in Plastic Sleeves
(No Suffix)
80 VOLTS, 20 WATTS
• Straight Lead Version in Plastic Sleeves (“−1” Suffix)
MARKING
DIAGRAMS
• Electrically Similar to Popular D44H/D45H Series
• Low Collector Emitter Saturation Voltage −
4
YWW
J4
xH11G
V
CE(sat)
= 1.0 Volt Max @ 8.0 Amperes
• Fast Switching Speeds
2
1
• Complementary Pairs Simplifies Designs
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
3
DPAK
CASE 369C
STYLE 1
• Pb−Free Packages are Available
4
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Emitter−Base Voltage
Symbol
Max
80
5
Unit
Vdc
Vdc
Adc
YWW
J4
xH11G
V
CEO
V
EB
1
2
Collector Current − Continuous
− Peak
I
8
16
C
3
DPAK−3
CASE 369D
STYLE 1
Total Power Dissipation
P
W
D
D
@ T = 25°C
20
0.16
C
Derate above 25°C
W/°C
Total Power Dissipation (Note 1)
P
W
Y
WW
=
=
=
Year
1.75
0.014
@ T = 25°C
A
Work Week
Device Code
x = 4 or 5
W/°C
°C
Derate above 25°C
J4xH11
Operating and Storage Junction
Temperature Range
T , T
−55 to +150
J
stg
G
=
Pb−Free Package
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
6.25
71.4
Unit
°C/W
°C/W
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Thermal Resistance, Junction−to−Case
R
q
JC
Thermal Resistance, Junction−to−Ambient
(Note 1)
R
q
JA
Lead Temperature for Soldering
T
260
°C
Preferred devices are recommended choices for future use
L
and best overall value.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
January, 2006 − Rev. 7
MJD44H11/D