MJD41C (NPN)
MJD42C (PNP)
Preferred Device
Complementary Power
Transistors
DPAK For Surface Mount Applications
http://onsemi.com
Designed for general purpose amplifier and low speed switching
applications.
SILICON
Features
POWER TRANSISTORS
6 AMPERES
100 VOLTS, 20 WATTS
• Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
• Straight Lead Version in Plastic Sleeves (“1” Suffix)
• Electrically Similar to Popular TIP41 and TIP42 Series
MARKING
DIAGRAMS
• Monolithic Construction With Built−in Base − Emitter Resistors
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
4
YWW
J4xCG
2
1
• Pb−Free Packages are Available
3
DPAK
CASE 369C
STYLE 1
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Max
100
100
5
Unit
Vdc
Vdc
Vdc
Adc
4
V
CEO
YWW
J4xCG
V
CB
EB
V
1
2
DPAK−3
CASE 369D
STYLE 1
I
6
10
Collector Current − Continuous
− Peak
C
3
Base Current
I
2
Adc
B
P
P
20
0.16
W
W/°C
Total Power Dissipation @ T = 25°C
D
D
C
Y
= Year
Derate above 25°C
WW = Work Week
J4xC = Device Code
x = 1 or 2
Total Power Dissipation (Note 1)
W
W/°C
°C
1.75
0.014
@ T = 25°C
A
G
= Pb−Free Package
Derate above 25°C
Operating and Storage Junction
Temperature Range
T , T
J
−65 to +150
stg
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
6.25
71.4
Unit
°C/W
°C/W
Preferred devices are recommended choices for future use
and best overall value.
Thermal Resistance, Junction−to−Case
R
q
JC
Thermal Resistance, Junction−to−Ambient
(Note 1)
R
q
JA
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
January, 2006 − Rev. 6
MJD41C/D