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MJD41C_06 PDF预览

MJD41C_06

更新时间: 2024-09-15 03:45:39
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
6页 79K
描述
Complementary Power Transistors

MJD41C_06 数据手册

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MJD41C (NPN)  
MJD42C (PNP)  
Preferred Device  
Complementary Power  
Transistors  
DPAK For Surface Mount Applications  
http://onsemi.com  
Designed for general purpose amplifier and low speed switching  
applications.  
SILICON  
Features  
POWER TRANSISTORS  
6 AMPERES  
100 VOLTS, 20 WATTS  
Lead Formed for Surface Mount Applications in Plastic Sleeves  
(No Suffix)  
Straight Lead Version in Plastic Sleeves (“1” Suffix)  
Electrically Similar to Popular TIP41 and TIP42 Series  
MARKING  
DIAGRAMS  
Monolithic Construction With Built−in Base − Emitter Resistors  
Epoxy Meets UL 94 V−0 @ 0.125 in  
ESD Ratings: Human Body Model, 3B u 8000 V  
Machine Model, C u 400 V  
4
YWW  
J4xCG  
2
1
Pb−Free Packages are Available  
3
DPAK  
CASE 369C  
STYLE 1  
MAXIMUM RATINGS  
Rating  
Collector−Emitter Voltage  
Collector−Base Voltage  
Emitter−Base Voltage  
Symbol  
Max  
100  
100  
5
Unit  
Vdc  
Vdc  
Vdc  
Adc  
4
V
CEO  
YWW  
J4xCG  
V
CB  
EB  
V
1
2
DPAK−3  
CASE 369D  
STYLE 1  
I
6
10  
Collector Current − Continuous  
− Peak  
C
3
Base Current  
I
2
Adc  
B
P
P
20  
0.16  
W
W/°C  
Total Power Dissipation @ T = 25°C  
D
D
C
Y
= Year  
Derate above 25°C  
WW = Work Week  
J4xC = Device Code  
x = 1 or 2  
Total Power Dissipation (Note 1)  
W
W/°C  
°C  
1.75  
0.014  
@ T = 25°C  
A
G
= Pb−Free Package  
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
J
−65 to +150  
stg  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
6.25  
71.4  
Unit  
°C/W  
°C/W  
Preferred devices are recommended choices for future use  
and best overall value.  
Thermal Resistance, Junction−to−Case  
R
q
JC  
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
q
JA  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. These ratings are applicable when surface mounted on the minimum pad  
sizes recommended.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 6  
MJD41C/D  
 

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