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MJD31T4 PDF预览

MJD31T4

更新时间: 2024-10-31 22:33:07
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管
页数 文件大小 规格书
6页 208K
描述
SILICON POWER TRANSISTORS 3 AMPERES 40 AND 100 VOLTS 15 WATTS

MJD31T4 技术参数

生命周期:Transferred包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:unknownHTS代码:8541.29.00.95
风险等级:5.18外壳连接:COLLECTOR
最大集电极电流 (IC):3 A集电极-发射极最大电压:40 V
配置:SINGLE最小直流电流增益 (hFE):10
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:NPN功耗环境最大值:15 W
最大功率耗散 (Abs):15 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE晶体管应用:AMPLIFIER
晶体管元件材料:SILICON标称过渡频率 (fT):3 MHz
最大关闭时间(toff):900 nsVCEsat-Max:1.2 V
Base Number Matches:1

MJD31T4 数据手册

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Order this document  
by MJD31/D  
SEMICONDUCTOR TECHNICAL DATA  
DPAK For Surface Mount Applications  
*Motorola Preferred Device  
Designed for general purpose amplifier and low speed switching applications.  
SILICON  
POWER TRANSISTORS  
3 AMPERES  
40 AND 100 VOLTS  
15 WATTS  
Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix)  
Straight Lead Version in Plastic Sleeves (“–1” Suffix)  
Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)  
Electrically Similar to Popular TIP31 and TIP32 Series  
MAXIMUM RATINGS  
MJD31  
MJD32  
MJD31C  
MJD32C  
Rating  
Symbol  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
Collector–Emitter Voltage  
Collector–Base Voltage  
Emitter–Base Voltage  
V
CEO  
40  
40  
100  
100  
CASE 369A–13  
V
CB  
V
EB  
5
I
C
Collector Current — Continuous  
Peak  
3
5
Base Current  
I
B
1
Adc  
P
D
Total Power Dissipation @ T = 25 C  
C
Derate above 25 C  
15  
Watts  
W/ C  
CASE 369–07  
0.12  
P
D
Total Power Dissipation* @ T = 25 C  
A
Derate above 25 C  
1.56  
Watts  
W/ C  
0.012  
Operating and Storage Junction  
Temperature Range  
T , T  
65 to +150  
C
J
stg  
MINIMUM PAD SIZES  
RECOMMENDED FOR  
SURFACE MOUNTED  
APPLICATIONS  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
8.3  
80  
Unit  
C/W  
C/W  
C
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient*  
Lead Temperature for Soldering Purposes  
R
R
θJC  
θJA  
T
L
260  
* These ratings are applicable when surface mounted on the minimum pad size recommended.  
inches  
mm  
Preferred devices are Motorola recommended choices for future use and best overall value.  
REV 1  
Motorola, Inc. 1995

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