MJD31, MJD31C (NPN),
MJD32, MJD32C (PNP)
Complementary Power
Transistors
DPAK For Surface Mount Applications
http://onsemi.com
Designed for general purpose amplifier and low speed switching
applications.
SILICON
POWER TRANSISTORS
3 AMPERES
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
• Straight Lead Version in Plastic Sleeves (“1” Suffix)
• Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)
• Electrically Similar to Popular TIP31 and TIP32 Series
• Epoxy Meets UL 94, V−0 @ 0.125 in
40 AND 100 VOLTS
15 WATTS
MARKING
DIAGRAMS
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
• These are Pb−Free Packages
4
DPAK
CASE 369C
STYLE 1
AYWW
J3xxG
2
1
MAXIMUM RATINGS
3
Rating
Symbol
Max
Unit
Collector−Emitter Voltage
V
Vdc
CEO
4
40
100
MJD31, MJD32
MJD31C, MJD32C
DPAK−3
CASE 369D
STYLE 1
YWW
J3xxG
Collector−Base Voltage
Emitter−Base Voltage
V
Vdc
CB
EB
40
MJD31, MJD32
MJD31C, MJD32C
1
100
2
3
V
5
Vdc
Adc
Collector Current − Continuous
− Peak
I
C
3
5
A
= Site Code
Y
= Year
WW
xx
G
= Work Week
= 1, 1C, 2, or 2C
= Pb−Free Package
Base Current
I
1
Adc
B
P
15
0.12
W
W/°C
Total Power Dissipation @ T = 25°C
Derate above 25°C
D
C
P
1.56
Total Power Dissipation @ T = 25°C
Derate above 25°C
W
W/°C
D
A
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
0.012
Operating and Storage Junction
Temperature Range
T , T
J
−65 to
+150
°C
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
8.3
80
Unit
°C/W
°C/W
°C
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient*
Lead Temperature for Soldering Purposes
R
q
JC
R
q
JA
T
L
260
*These ratings are applicable when surface mounted on the minimum pad sizes
recommended.
©
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
February, 2011 − Rev. 8
MJD31/D