MJD31, MJD31C (NPN),
MJD32, MJD32C (PNP)
MJD31C and MJD32C are Preferred Devices
Complementary Power
Transistors
DPAK For Surface Mount Applications
http://onsemi.com
Designed for general purpose amplifier and low speed switching
applications.
SILICON
POWER TRANSISTORS
3 AMPERES
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
• Straight Lead Version in Plastic Sleeves (“1” Suffix)
• Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)
• Electrically Similar to Popular TIP31 and TIP32 Series
40 AND 100 VOLTS
15 WATTS
• Epoxy Meets UL 94, V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
MARKING
DIAGRAMS
• Pb−Free Packages are Available
4
DPAK
YWW
CASE 369C
STYLE 1
J3xxG
2
1
MAXIMUM RATINGS
3
Rating
Symbol
Max
Unit
Collector−Emitter Voltage
V
Vdc
CEO
4
40
100
MJD31, MJD32
MJD31C, MJD32C
DPAK−3
CASE 369D
STYLE 1
YWW
J3xxG
Collector−Base Voltage
Emitter−Base Voltage
V
Vdc
CB
EB
40
100
MJD31, MJD32
MJD31C, MJD32C
1
2
3
V
5
Vdc
Adc
Collector Current − Continuous
− Peak
I
3
5
C
Y
WW
xx
= Year
= Work Week
= 1, 1C, 2, or 2C
Base Current
I
1
Adc
B
G
= Pb−Free Package
P
P
15
0.12
W
W/°C
Total Power Dissipation @ T = 25°C
Derate above 25°C
D
D
C
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
1.56
0.012
Total Power Dissipation @ T = 25°C
Derate above 25°C
W
W/°C
A
Operating and Storage Junction
Temperature Range
T , T
−65 to
+150
°C
J
stg
Preferred devices are recommended choices for future use
and best overall value.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
8.3
80
Unit
°C/W
°C/W
°C
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient*
Lead Temperature for Soldering Purposes
R
q
JC
R
q
JA
T
260
L
*These ratings are applicable when surface mounted on the minimum pad sizes
recommended.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
June, 2005 − Rev. 6
MJD31/D