MJD122 (NPN)
MJD127 (PNP)
Preferred Device
Complementary Darlington
Power Transistor
DPAK For Surface Mount Applications
http://onsemi.com
Designed for general purpose amplifier and low speed switching
applications.
SILICON
POWER TRANSISTOR
8 AMPERES
100 VOLTS, 20 WATTS
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
• Surface Mount Replacements for 2N6040−2N6045 Series,
TIP120−TIP122 Series, and TIP125−TIP127 Series
• Monolithic Construction With Built−in Base−Emitter Shunt Resistors
• High DC Current Gain: h = 2500 (Typ) @ I = 4.0 Adc
4
DPAK
CASE 369C
STYLE 1
FE
C
2
1
• Epoxy Meets UL 94 V−0 @ 0.125 in
3
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
MARKING DIAGRAM
• Pb−Free Packages are Available
MAXIMUM RATINGS
YWW
J12xG
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Value
100
100
5
Unit
Vdc
Vdc
Vdc
Adc
V
CEO
V
CB
EB
Y
= Year
WW = Work Week
V
x
G
= 2 or 7
= Pb−Free Package
Collector Current − Continuous
− Peak
I
8
16
C
Base Current
I
120
mAdc
B
ORDERING INFORMATION
Total Power Dissipation @ T = 25°C
P
P
20
0.16
W
W/°C
C
D
D
†
75 Units/Rail
75 Units/Rail
Derate above 25°C
Device
Package
Shipping
MJD122
DPAK
Total Power Dissipation (Note 1)
@ T = 25°C
1.75
0.014
W
W/°C
A
MJD122G
DPAK
Derate above 25°C
(Pb−Free)
Operating and Storage Junction
Temperature Range
T , T
−65 to +150
°C
J
stg
MJD122T4
DPAK
2500/Tape & Reel
2500/Tape & Reel
MJD122T4G
DPAK
THERMAL CHARACTERISTICS
Characteristic
(Pb−Free)
Symbol
Max
Unit
DPAK
75 Units/Rail
75 Units/Rail
MJD127
Thermal Resistance
Junction−to−Case
R
q
JC
6.25
°C/W
MJD127G
DPAK
(Pb−Free)
Thermal Resistance
R
71.4
°C/W
q
JA
MJD127T4
DPAK
2500/Tape & Reel
2500/Tape & Reel
Junction−to−Ambient (Note1)
MJD127T4G
DPAK
(Pb−Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
December, 2005 − Rev. 7
MJD122/D