MIXG360RF1200PTED
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VCES
IC25
1200V
532A
1.7V
XPT IGBT Module
VCE(sat)
Boost/Brake Chopper + free wheeling Diode + NTC
Part number
MIXG360RF1200PTED
Backside: isolated
15-18
27-32
46
49
48
47
2-7
E2-Pack
Features / Advantages:
Applications:
Package:
● X2PT - 2nd generation Xtreme light Punch Through
● Rugged X2PT design results in:
- short circuit rated for 10 µsec.
- very low gate charge
- low EMI
- square RBSOA @ 2x Ic
● Thin wafer technology combined with X2PT design
results in a competitive low VCE(sat)
● Easy paralleling due to the positive temperature
coefficient of the on-state voltage
● SONIC™ diode
● AC motor drives
● Solar inverter
● Isolation Voltage:
● Industry standard outline
● RoHS compliant
● PressFit-Pins for PCB mounting
● Height: 17 mm
● Base plate: Copper
internally DCB isolated
V~
3600
● Medical equipment
● Uninterruptible power supply
● Air-conditioning systems
● Welding equipment
● Switched-mode and resonant-mode
power supplies
● Advanced power cycling
● Phase Change Material available
● Inductive heating, cookers
● Pumps, Fans
- fast and soft reverse recovery
- low operating forward voltage
Terms and Conditions of Usage
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns
the specific application of your product, please contact your local sales office.
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office.
Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend
- to perform joint risk and quality assessments;
- the conclusion of quality agreements;
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.
IXYS reserves the right to change limits, conditions and dimensions.
Data according to IEC 60747and per semiconductor unless otherwise specified
20171128b
© 2017 IXYS all rights reserved