Document Number: IMXRT1064IEC
Rev. 3, 03/2021
NXP Semiconductors
Data Sheet: Technical Data
MIMXRT1064CVL5A
MIMXRT1064CVJ5A
MIMXRT1064CVL5B
MIMXRT1064CVJ5B
i.MX RT1064 Crossover
Processors for Industrial
Products
Package Information
Plastic Package
196-pin MAPBGA, 10 x 10 mm, 0.65 mm pitch
196-pin MAPBGA, 12 x 12 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 6
1 i.MX RT1064 Introduction
The i.MX RT1064 is a new processor family featuring
NXP’s advanced implementation of the Arm
1. i.MX RT1064 Introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 5
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1. Special signal considerations . . . . . . . . . . . . . . . 16
3.2. Recommended connections for unused analog
®
Cortex -M7 core, which operates at speeds up to 528
MHz to provide high CPU performance and best
real-time response.
The i.MX RT1064 processor has 4 MB on chip Flash and
1 MB on-chip RAM. 512 KB SRAM can be flexibly
configured as TCM or general-purpose on-chip RAM,
while the other 512 KB SRAM is general-purpose
on-chip RAM. The i.MX RT1064 integrates advanced
power management module with DCDC and LDO that
reduces complexity of external power supply and
simplifies power sequencing. The i.MX RT1064 also
provides various memory interfaces, including SDRAM,
RAW NAND FLASH, NOR FLASH, SD/eMMC, Quad
SPI, and a wide range of other interfaces for connecting
peripherals, such as WLAN, Bluetooth™, GPS,
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 19
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 26
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 38
4.5. External memory interface . . . . . . . . . . . . . . . . . 43
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 53
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 66
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
5. Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 82
6.1. Boot mode configuration pins . . . . . . . . . . . . . . . 82
6.2. Boot device interface allocation . . . . . . . . . . . . . . 82
7. Package information and contact assignments . . . . . . . 87
7.1. 10 x 10 mm package information . . . . . . . . . . . . 87
7.2. 12 x 12 mm package information . . . . . . . . . . . . 99
8. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
displays, and camera sensors. The i.MX RT1064 has rich
audio and video features, including LCD display, basic
2D graphics, camera interface, SPDIF, and I2S audio
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.