Document Number: IMXRT1060CEC
Rev. 0.2, 02/2020
NXP Semiconductors
Data Sheet: Technical Data
MIMXRT1061DVL6A
MIMXRT1061DVJ6A
MIMXRT1062DVL6A
MIMXRT1062DVJ6A
i.MX RT1060 Crossover
Processors for Consumer
Products
Package Information
Plastic Package
196-pin MAPBGA, 10 x 10 mm, 0.65 mm pitch
196-pin MAPBGA, 12 x 12 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 6
1 i.MX RT1060 Introduction
The i.MX RT1060 is a new processor family featuring
NXP’s advanced implementation of the Arm
1. i.MX RT1060 Introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1. Special signal considerations . . . . . . . . . . . . . . . 17
3.2. Recommended connections for unused analog
®
Cortex -M7 core, which operates at speeds up to 600
MHz to provide high CPU performance and best
real-time response.
The i.MX RT1060 processor has 1 MB on-chip RAM.
512 KB can be flexibly configured as TCM or general
purpose on-chip RAM, while the other 512 KB is
general-purpose on-chip RAM. The i.MX RT1060
integrates advanced power management module with
DCDC and LDO that reduces complexity of external
power supply and simplifies power sequencing. The
i.MX RT1060 also provides various memory interfaces,
including SDRAM, RAW NAND FLASH, NOR
FLASH, SD/eMMC, Quad SPI, and a wide range of
other interfaces for connecting peripherals, such as
WLAN, Bluetooth™, GPS, displays, and camera
sensors. The i.MX RT1060 has rich audio and video
features, including LCD display, basic 2D graphics,
camera interface, SPDIF, and I2S audio interface. The
i.MX RT1060 has analog interfaces, such as ADC,
ACMP, and TSC.
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 27
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 38
4.5. External memory interface . . . . . . . . . . . . . . . . . 43
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 53
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 66
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 81
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 81
5.2. Boot device interface allocation . . . . . . . . . . . . . . 81
6. Package information and contact assignments . . . . . . . 86
6.1. 10 x 10 mm package information . . . . . . . . . . . . 86
6.2. 12 x 12 mm package information . . . . . . . . . . . . 98
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.
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