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MIMXRT1052CVJ5B PDF预览

MIMXRT1052CVJ5B

更新时间: 2024-11-19 02:49:35
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
110页 1950K
描述
Crossover processors data sheet for industrial products

MIMXRT1052CVJ5B 数据手册

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Document Number: IMXRT1050IEC  
Rev. 1.4, 01/2020  
NXP Semiconductors  
Data Sheet: Technical Data  
MIMXRT1051CVL5A  
MIMXRT1052CVL5A  
MIMXRT1052CVL5B  
MIMXRT1052CVJ5B  
MIMXRT1051CVL5B  
MIMXRT1051CVJ5B  
i.MX RT1050 Crossover  
Processors Data Sheet  
for Industrial Products  
Package Information  
Plastic Package  
196-pin MAPBGA, 10 x 10 mm, 0.65 mm pitch  
196-pin MAPBGA, 12 x 12 mm, 0.8 mm pitch  
Ordering Information  
See Table 1 on page 5  
1 i.MX RT1050 introduction  
The i.MX RT1050 is a new processor family featuring  
NXP’s advanced implementation of the Arm  
1. i.MX RT1050 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 5  
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
3.1. Special signal considerations . . . . . . . . . . . . . . . 15  
3.2. Recommended connections for unused analog  
®
Cortex -M7 core, which operates at speeds up to 528  
MHz to provide high CPU performance and best  
real-time response.  
The i.MX RT1050 processor has 512 KB on-chip RAM,  
which can be flexibly configured as TCM or  
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 18  
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 18  
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 25  
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 36  
4.5. External memory interface . . . . . . . . . . . . . . . . . 41  
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 51  
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 64  
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 79  
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 79  
5.2. Boot device interface allocation . . . . . . . . . . . . . . 79  
6. Package information and contact assignments . . . . . . . 84  
6.1. 10 x 10 mm package information . . . . . . . . . . . . 84  
6.2. 12 x 12 mm package information . . . . . . . . . . . . 96  
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
general-purpose on-chip RAM. The i.MX RT1050  
integrates advanced power management module with  
DCDC and LDO that reduces complexity of external  
power supply and simplifies power sequencing. The  
i.MX RT1050 also provides various memory interfaces,  
including SDRAM, RAW NAND FLASH, NOR  
FLASH, SD/eMMC, Quad SPI, and a wide range of  
other interfaces for connecting peripherals, such as  
WLAN, Bluetooth™, GPS, displays, and camera  
sensors. The i.MX RT1050 also has rich audio and video  
features, including LCD display, basic 2D graphics,  
camera interface, SPDIF, and I2S audio interface. The  
NXP reserves the right to change the production detail specifications as may be required  
to permit improvements in the design of its products.  

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