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MIMXRT1051DVL6B PDF预览

MIMXRT1051DVL6B

更新时间: 2024-11-21 01:11:15
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
93页 1471K
描述
i.MX RT1050 Crossover Processors for Consumer

MIMXRT1051DVL6B 数据手册

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Document Number: IMXRT1050CEC  
Rev. 1, 03/2018  
NXP Semiconductors  
Data Sheet: Technical Data  
MIMXRT1051DVL6A  
MIMXRT1051DVL6B  
MIMXRT1052DVL6A  
MIMXRT1052DVL6B  
i.MX RT1050 Crossover  
Processors for Consumer  
Products  
Package Information  
Plastic Package  
196-pin MAPBGA, 10 x 10 mm, 0.65 mm pitch  
Ordering Information  
See Table 1 on page 5  
1 i.MX RT1050 introduction  
The i.MX RT1050 is a new processor family featuring  
NXP’s advanced implementation of the Arm  
1. i.MX RT1050 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 5  
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.1. Special signal considerations . . . . . . . . . . . . . . . 14  
3.2. Recommended connections for unused analog  
®
Cortex -M7 core, which operates at speeds up to 600  
MHz to provide high CPU performance and best  
real-time response.  
The i.MX RT1050 processor has 512 KB on-chip RAM,  
which can be flexibly configured as TCM or  
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 17  
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 23  
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 34  
4.5. External memory interface . . . . . . . . . . . . . . . . . 38  
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 48  
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 60  
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73  
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 75  
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 75  
5.2. Boot device interface allocation . . . . . . . . . . . . . . 75  
6. Package information and contact assignments . . . . . . . 80  
6.1. 10 x 10 mm package information . . . . . . . . . . . . 80  
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92  
general-purpose on-chip RAM. The i.MX RT1050  
integrates advanced power management module with  
DCDC and LDO that reduces complexity of external  
power supply and simplifies power sequencing. The  
i.MX RT1050 also provides various memory interfaces,  
including SDRAM, RAW NAND FLASH, NOR  
FLASH, SD/eMMC, Quad SPI, and a wide range of  
other interfaces for connecting peripherals, such as  
WLAN, Bluetooth™, GPS, displays, and camera  
sensors. The i.MX RT1050 also has rich audio and video  
features, including LCD display, basic 2D graphics,  
camera interface, SPDIF, and I2S audio interface.  
© 2017-2018 NXP Semiconductors. All rights reserved.  

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