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MIG15J503H

更新时间: 2024-01-29 06:50:22
品牌 Logo 应用领域
东芝 - TOSHIBA 运动控制电子器件信号电路
页数 文件大小 规格书
11页 106K
描述
TOSHIBA INTELLIGENT POWER MODULE

MIG15J503H 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.73
最大集电极电流 (IC):15 A集电极-发射极最大电压:600 V
元件数量:1最高工作温度:100 °C
最大功率耗散 (Abs):43 W子类别:Insulated Gate BIP Transistors
VCEsat-Max:2.1 VBase Number Matches:1

MIG15J503H 数据手册

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MIG15J503H  
TOSHIBA INTELLIGENT POWER MODULE  
M I G 1 5 J 5 0 3 H  
MIG15J503H is an intelligent power module for three-phase  
inverter system. The 4th generation low saturation voltage trench  
gate IGBT and FRD are connected to a three-phase full bridge  
type, and IC by the original high-voltage SOI(silicon-on-insulator)  
process drives these directly in response to a PWM signal.  
Moreover, since high-voltage level-shifter is built in high-voltage  
IC, while being able to perform a direct drive without the  
interface with which the upper arm IGBT is insulated, the drive  
power supply of an upper arm can be driven with a bootstrap  
system, and the simplification of  
Furthermore, each lower arm emitter terminal has been  
a
system is possible.  
Weight:18 g (Typ.)  
independent so that detection can perform current detection at the time of vector control by current detection  
resistance of a lower arm. The protection function builds in Under Voltage Protection, Short Circuit Protection, and  
Over Temperature Protection. Original high thermal conduction resin is adopted as a package, and low heat  
resistance is realized.  
Feature  
·
·
·
·
The 4th generation trench gate thin wafer NPT IGBT is adopted.  
FRD is built in.  
The level shift circuit by high-voltage IC is built in.  
The simplification of a high side driver power supply is possible by the bootstrap system.  
·
Short Circuit Protection, Over Temperature Protection , and the Power Supply Under Voltage Protection  
function are built in.  
·
·
Short Circuit Protection and Over Temperature Protection state are outputted.  
The lower arm emitter terminal has been independent by each phase for the purpose of the current detection at  
the time of vector control.  
·
Low thermal resistance by adoption of original high thermal conduction resin.  
Since this product is MOS structure, it should be careful of static electricity in the case of handling.  
This tentative specification is a development examination stage, and may change the contents without  
a preliminary announcement.  
TOSHIBA CONFIDENTIAL  
1
2002/12/10  

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