生命周期: | Active | 包装说明: | , DIE OR CHIP |
Reach Compliance Code: | compliant | 风险等级: | 5.69 |
JESD-30 代码: | R-XDMA-P9 | 长度: | 40.64 mm |
功能数量: | 1 | 端子数量: | 9 |
最高工作温度: | 70 °C | 最低工作温度: | -10 °C |
封装主体材料: | UNSPECIFIED | 封装等效代码: | DIE OR CHIP |
封装形状: | RECTANGULAR | 封装形式: | MICROELECTRONIC ASSEMBLY |
座面最大高度: | 11.43 mm | 标称供电电压: | 3.3 V |
表面贴装: | NO | 电信集成电路类型: | TELECOM CIRCUIT |
温度等级: | COMMERCIAL | 端子形式: | PIN/PEG |
端子位置: | DUAL | 宽度: | 35.306 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
0900-3-00-00-00-00-11-0 | MILL-MAX | SPRING-LOADED CONNECTORS Discrete Spring-Loaded Contacts |
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|
0900-3-15-20-75-14-11-0 | MILL-MAX | PCB Terminal, |
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|
0900-4 | MILL-MAX | SPRING-LOADED CONNECTORS Discrete Spring-Loaded Contacts |
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|
0900-4-00-00-00-00-11-0 | MILL-MAX | SPRING-LOADED CONNECTORS Discrete Spring-Loaded Contacts |
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|
0900590007 | MOLEX | 2.54mm (.100) Pitch C-Grid® Micro Shunt, Low |
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|
0900590007_17 | MOLEX | 2.54mm Pitch C-Grid Micro Shunt, Low Profile, |
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