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HV53001 PDF预览

HV53001

更新时间: 2023-12-18 00:00:00
品牌 Logo 应用领域
美国微芯 - MICROCHIP /
页数 文件大小 规格书
40页 1904K
描述
16-Channel, ±135V Push-Pull Driver with RTZ, Current Sensor and Built-in Boost Converter

HV53001 数据手册

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HV53001  
16-Channel, ±135V Push-Pull Driver with RTZ,  
Current Sensor and Built-in Boost Converter  
Features  
General Description  
• 16-Channel Push-Pull Output  
The HV53001 device is an integrated driver solution  
for various applications, which consists of three main  
functional blocks (1) high-voltage driver, (2) SPI inter-  
face and (3) DC/DC boost controller with power  
MOSFET.  
• Return-To-Zero (RTZ) and High-Impedance (Hi-Z)  
Function  
• Up to ±135V Output Voltage  
• 24 mA Minimum Source Sink Output Current  
• 250 pF Maximum Output Load  
• Current Sensor Output  
The high-voltage driver block includes 16 push-pull  
drivers capable of ±135V output swing with Return-To-  
Zero (RTZ) function. Each output driver is capable of  
sourcing and sinking at least 24 mA. Each high-volt-  
age output is capable of driving up to 250 pF capaci-  
tive load. A global current sensor function is also  
integrated into this device to monitor the charge and  
discharge currents. The measured current is mapped  
to a low-voltage analog output with a scale factor of  
3.1 V/V via a current sensing resistor.  
• SPI Interface with Quad-Latched 2-bit per Chan-  
nel Architecture  
• Power-on Reset Function  
• DC/DC Boost Converter with Power MOSFET  
• 2.7 to 5.5V Converter Input Voltage  
• Short Circuit Protection  
• Overtemperature Monitor  
The SPI interface is used to communicate between the  
host processor and the high-voltage drivers. This inter-  
face accepts a 3.3V logic I/O signal up to clock speed  
of 32 MHz. Five digital LATCH control signals manage  
the data flow and the firing pattern. It establishes the  
output to one of four possible states: VPP, VNN, 0V or  
high impedance.  
• Power ON/OFF Sequence Control  
• Shutdown Function  
• 105-ball 9 x 9 mm TFBGA Package  
Application  
• Surface Haptic Application  
• MEMS Driver  
This IC also includes an integrated DC/DC controller  
with power MOSFET. The controller is used in a fly-  
back configuration to generate four high-voltage rails,  
±135V and ±123V, for the high-voltage driver block.  
The ±123V rails are created from two 12V floating sup-  
plies referenced to the ±135V supply rails.  
• Piezo Driver  
The converter accepts input voltage from a single  
2.7V-5.5V input voltage rail. A built-in positive charge  
pump and a simple external negative charge pump  
convert the input supply to +6.5V and -6.0V supplies to  
power the high-voltage driver block.  
Aproper power on and off sequence is critical to ensure  
the operation of the high-voltage driver. A power  
sequence control circuit is included for the user to con-  
trol the power supplies to power up or down the high-  
voltage driver. It is used in conjunction with the external  
high-voltage FET transistors.  
Safety features are added to the DC/DC converter. The  
overvoltage protection monitors both high-voltage rails  
to protect the driver against an overvoltage condition.  
Short circuit protection detects any short circuit event at  
the high-voltage rails by monitoring the current flow  
2021 Microchip Technology Inc.  
DS20006518A-page 1  

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