是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | HVSON, SOLCC6,.08,25 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.67 |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-XDSO-N6 |
JESD-609代码: | e4 | 长度: | 2 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 6 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVSON | 封装等效代码: | SOLCC6,.08,25 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 0.9 mm | 最大供电电流 (Isup): | 0.3 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | NO LEAD | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 2 mm | Base Number Matches: | 1 |
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