Datasheet > MH160822NJL

MH160822NJL

更新时间： 2024-11-27 11:02:03

品牌	Logo	应用领域
ABC		电感器
页数	文件大小	规格书
5页	377K
描述
MULTILAYER CHIP INDUCTOR

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中文翻译

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数据手册

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MH160822NJL 数据手册

SPECIFICATION FOR APPROVAL

REF :

PROD.

NAME

PAGE: 1

MH1608□□□□L□-□□□

ABC'S DWG NO.

ABC'S ITEM NO.

MULTILAYER CHIP INDUCTOR

Ⅰ CONFIGURATION & DIMENSIONS：

1.60±0.15

m/m

0.80±0.15

0.30±0.20

m/m

Ⅱ SCHEMATIC DIAGRAM：

Ⅲ FEATURES：

Monolithic structure ensuring high performance and reliability.

High frequency applications up to 6GHz.

Terminal：Ag/Cu/Ni/Sn

Remark：Products comply with RoHS' requirements

Ⅳ APPLICATIONS：

RF modules for telecommunication systems including

GSM, PCS,DECT,WLAN,Bluetooth,etc.

Peak Temp：260℃ max.

Max time above 230℃ ：50sec max.

Max time above 200℃ ：70sec max.

Temperature

Ⅴ GENERAL SPECIFICATION：

Rising Area

Preheat Area

Reflow Area

Forced Cooling Area

+2.0 ~ 4.0℃

Storage temp.：-55℃---- +125℃

+4.0℃ / sec max.

150 ~ 200℃ / 60 ~ 120sec

-(1.0 ~ 5.0)℃ / sec max.

/ sec max.

Peak Temperature:

Operating temp.：-55℃ ---- +125℃

260℃

250

200

150

100

230℃

50sec max.

Solderability：Preheat 150℃. 60 sec

Solder：H63A

Solder temp.：230±5℃

Flux：Rosin

Dip time：4±1 sec

70sec max.

100

150

Time ( seconds )

200

250

AR-001A

12 3 4 5

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