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MH1005R10J2 PDF预览

MH1005R10J2

更新时间: 2024-09-18 11:02:03
品牌 Logo 应用领域
ABC 电感器
页数 文件大小 规格书
6页 110K
描述
MULTILAYER CHIP INDUCTOR

MH1005R10J2 数据手册

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SPECIFICATION FOR APPROVAL  
REF :  
PROD.  
NAME  
PAGE: 1  
ABC'S DWG NO.  
ABC'S ITEM NO.  
MH1005□□□□2-□□□  
MULTILAYER CHIP INDUCTOR  
Ⅰ﹒CONFIGURATION & DIMENSIONS:  
A
A
B
C
D
:
:
:
:
1.00±0.10  
0.50±0.10  
0.50±0.10  
0.23±0.10  
m/m  
m/m  
m/m  
m/m  
D
Ⅱ﹒SCHEMATIC DIAGRAM:  
Ⅲ﹒FEATURES:  
aMonolithic structure ensuring high performance and reliability.  
bHigh frequency applications up to 6GHz.  
cTerminalAg/Cu/Ni/Sn  
dRemarkProducts comply with RoHS' requirements  
Ⅳ﹒APPLICATIONS:  
aRF modules for telecommunication systems including  
GSM, PCS,DECT,WLAN,Bluetooth,etc.  
Peak Temp260max.  
Max time above 230℃ :50sec max.  
Max time above 200℃ :70sec max.  
Temperature  
Ⅴ﹒GENERAL SPECIFICATION:  
aStorage temp.-55---- +125℃  
bOperating temp.-55---- +125℃  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
+2.0 ~ 4.0  
/ sec max.  
+4.0/ sec max.  
150 ~ 200/ 60 ~ 120sec  
-(1.0 ~ 5.0)/ sec max.  
Peak Temperature:  
260  
250  
200  
150  
100  
50  
230℃  
50sec max.  
cSolderabilityPreheat 150. 60 sec  
SolderH63A  
70sec max.  
Solder temp.230±5℃  
FluxRosin  
Dip time4±1 sec  
50  
100  
150  
Time ( seconds )  
200  
250  
0
AR-001A  

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