Product specification
MGSF1N03L, MVGSF1N03L
Power MOSFET
30 V, 2.1 A, Single N−Channel, SOT−23
V
R
TYP
I MAX
D
(BR)DSS
DS(on)
80 mW @ 10 V
30 V
2.1 A
These miniature surface mount MOSFETs low R
assure
125 mW @ 4.5 V
DS(on)
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry. Typical
applications are dc−dc converters and power management in portable
and battery−powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
N−Channel
D
Features
• Low R
Provides Higher Efficiency and Extends Battery Life
DS(on)
G
• Miniature SOT−23 Surface Mount Package Saves Board Space
• AEC−Q101 Qualified and PPAP Capable − MVGSF1N03LT1
• These Devices are Pb−Free and are RoHS Compliant
S
MARKING DIAGRAM/
PIN ASSIGNMENT
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
30
Unit
V
3
Drain
V
DSS
Gate−to−Source Voltage
V
20
V
GS
N3 M G
1
SOT−23
CASE 318
STYLE 21
Continuous Drain
Current R
Steady T = 25°C
I
2.1
A
G
A
D
State
q
JL
T = 85°C
A
1.5
1
2
Power Dissipation
R
Steady T = 25°C
P
0.69
W
A
A
D
Gate
Source
State
q
JL
N3
M
G
= Specific Device Code
= Date Code*
= Pb−Free Package
Continuous Drain
Current (Note 1)
Steady T = 25°C
I
1.6
1.2
A
D
State
T = 85°C
A
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Power Dissipation
(Note 1)
T = 25°C
A
P
0.42
W
D
Pulsed Drain Current
t = 10 ms
p
I
6.0
A
V
DM
ESD Capability
(Note 3)
C = 100 pF,
RS = 1500 W
ESD
125
ORDERING INFORMATION
†
Device
Package
Shipping
Operating Junction and Storage Temperature T , T
−55 to 150
2.1
°C
A
J
STG
MGSF1N03LT1G
MGSF1N03LT3G
SOT−23
Pb−Free
3000 / Tape &
Reel
Source Current (Body Diode)
I
S
Lead Temperature for Soldering Purposes
(1/8” from case for 10 sec)
T
260
°C
L
SOT−23
(Pb−Free)
10000 / Tape &
Reel
THERMAL RESISTANCE RATINGS
MVGSF1N03LT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
Parameter
Symbol
Max
180
300
250
400
Unit
Junction−to−Foot − Steady State
R
°C/W
q
JL
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t < 10 s (Note 1)
Junction−to−Ambient − Steady State (Note 2)
R
q
JA
R
q
JA
R
q
JA
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
1. Surface−mounted on FR4 board using 650 mm , 1 oz. Cu pad size.
2
2. Surface−mounted on FR4 board using 50 mm , 1 oz. Cu pad size.
3. ESD Rating Information: HBM Class 0.
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