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MFR9030MBR1 PDF预览

MFR9030MBR1

更新时间: 2024-11-17 03:02:43
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
12页 622K
描述
TRANSISTOR,MOSFET,N-CHANNEL,65V V(BR)DSS,TO-272

MFR9030MBR1 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:,Reach Compliance Code:unknown
风险等级:5.92配置:Single
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-609代码:e0
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):139 W
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)

MFR9030MBR1 数据手册

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ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ  
SEMICONDUCTOR TECHNICAL DATA  
Freescale Semiconductor, Inc.  
Order this document  
by MRF9030M/D  
The RF Sub-Micron MOSFET Line  
ꢀꢁ ꢂ ꢃꢄꢅ ꢆ ꢁꢇ ꢅꢈ ꢉ ꢊ ꢋꢋꢅꢌ ꢍ ꢎꢆ ꢏꢐ ꢑ ꢇꢑ ꢍꢃ ꢆ ꢑ  
N-Channel Enhancement-Mode Lateral MOSFETs  
Designed for broadband commercial and industrial applications with frequen-  
cies up to 1.0 GHz. The high gain and broadband performance of these devices  
make them ideal for large-signal, common-source amplifier applications in  
26 volt base station equipment.  
945 MHz, 30 W, 26 V  
LATERAL N-CHANNEL  
BROADBAND  
RF POWER MOSFETs  
Typical Performance at 945 MHz, 26 Volts  
Output Power — 30 Watts PEP  
Power Gain — 20 dB  
Efficiency — 41% (Two Tones)  
IMD — -31 dBc  
Integrated ESD Protection  
CASE 1265-08, STYLE 1  
TO-270-2  
Capable of Handling 5:1 VSWR, @ 26 Vdc, 945 MHz, 30 Watts (CW)  
Output Power  
PLASTIC  
MRF9030MR1  
Excellent Thermal Stability  
Characterized with Series Equivalent Large-Signal Impedance Parameters  
Dual-Lead Boltdown Plastic Package Can Also Be Used As Surface  
Mount.  
TO-272-2 in Tape and Reel. R1 Suffix = 500 Units per 44 mm,  
13 inch Reel.  
CASE 1337-03, STYLE 1  
TO-272-2  
TO-270-2 in Tape and Reel. R1 Suffix = 500 Units per 24 mm,  
PLASTIC  
MRF9030MBR1  
13 inch Reel.  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain-Source Voltage  
Gate-Source Voltage  
V
DSS  
V
+15, -0.5  
GS  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
139  
0.93  
Watts  
W/°C  
C
D
Storage Temperature Range  
Operating Junction Temperature  
T
-65 to +150  
175  
°C  
°C  
stg  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
θ
JC  
1.08  
°C/W  
ESD PROTECTION CHARACTERISTICS  
Test Conditions  
Class  
Human Body Model  
1 (Minimum)  
M2 (Minimum)  
Machine Model  
Charge Device Model  
MRF9030MR1  
MRF9030MBR1  
C7 (Minimum)  
C6 (Minimum)  
MOISTURE SENSITIVITY LEVEL  
Test Methodology  
Rating  
Per JESD 22-A113  
3
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 6  
Motorola, Inc. 2003  
For More Information On This Product,  
Go to: www.freescale.com  

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