Datasheet > 射频和微波 > 射频/微波分光器/合路器> PDD-3Z-1.9G

PDD-3Z-1.9G

更新时间： 2024-02-25 02:57:25

品牌	Logo	应用领域
MERRIMAC		射频和微波射频分光器射频合路器微波分光器微波合路器
页数	文件大小	规格书
5页	142K
描述
3-WAY POWER DIVIDERS

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PDD-3Z-1.9G 技术参数

生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.73	构造：	COMPONENT
最大输入功率 (CW)：	30 dBm	最大插入损耗：	0.3 dB
最大工作频率：	2000 MHz	最小工作频率：	1700 MHz
最高工作温度：	85 °C	最低工作温度：	-55 °C
射频/微波设备类型：	SPLITTER	最大电压驻波比：	1.5
Base Number Matches：	1

PDD-3Z-1.9G 数据手册

PDD-3Z-1.9G

3-WAY POWER DIVIDERS

REV: 002, 01/07/03

•

1.7 - 2.0 GHz

LOW LOSS

HIGH ISOLATION

SURFACE MOUNT

TAPE & REEL

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX PICO™ Z-SERIES POWER DIVIDERS

The Multi-Mix® PDD-Z series provides an in-phase, binary power divider with low insertion loss in a

small outline. Accurate phase and amplitude balance make them ideal for applications involving IQ net-

works, power amplifiers, signal distribution and processing.

PDD-Z power dividers are fusion bonded multilayer stripline assemblies. The fusion bonding process

yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform-

ance that is superior to conventional adhesive bonding techniques.

The PDD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless appli-

cations. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible

with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides

excellent EM shielding.

Additional benefits include:

AVAILABLE ON

TAPE & REEL

Available on tape and reel

Cost effective for commercial wireless applications

Small outline size

Operating temperature range –55?C to +85?C.

Can be integrated with other Multi-Mix® components in a multi-function module

RELIABILITY

The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,

Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life

Test (>1000 cycles).

THE MULTI-MIX PROCESS

Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-

lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded

layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-

through vias to form a SMD module that requires no additional packaging and is suitable for automated

assembly.

THE MULTI-MIX MICROTECHNOLOGY^®GROUP IS ISO-9001 REGISTERED

U.S. patent 6,099,677 and other patents pending.

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.6636 / Fax: 973.882.5990 / Email: pico@merrimacind.com / www.Multi-Mix.com

12 3 4 5

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