Datasheet > 射频和微波 > 射频/微波耦合器> CSD-20H-0.9G

CSD-20H-0.9G

更新时间： 2024-01-14 22:18:24

品牌	Logo	应用领域
MERRIMAC		射频和微波射频耦合器微波耦合器分离技术隔离技术
页数	文件大小	规格书
5页	149K
描述
DIRECTIONAL COUPLER

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技术参数
数据手册

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CSD-20H-0.9G 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.71	Is Samacsys：	N
其他特性：	HIGH ISOLATION	构造：	COMPONENT
最大输入功率 (CW)：	51.76 dBm	最大插入损耗：	0.25 dB
最大工作频率：	1000 MHz	最小工作频率：	800 MHz
最高工作温度：	85 °C	最低工作温度：	-55 °C
射频/微波设备类型：	DIRECTIONAL COUPLER	最大电压驻波比：	1.25
Base Number Matches：	1

CSD-20H-0.9G 数据手册

CSD-20H-0.9G

DIRECTIONAL COUPLER

REV: 002, 02/13/03

•

0.8 - 1.0 GHz

LOWEST LOSS

HIGHEST ISOLATION

BEST PHASE/AMPLITUDE BALANCE

SURFACE MOUNT

• TAPE & REEL

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX^®DIRECTIONAL COUPLERS

The Multi-Mix^®CSD series provides directional couplers with low insertion loss, low VSWR, and high

directivity. Precise coupling and frequency sensitivity make them ideal for applications power ampli-

fiers, signal distribution and processing.

CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process

yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform-

ance that is superior to conventional adhesive bonding techniques.

The CSD series is an easy to install SMD designed specifically for the full spectrum of wireless applica-

tions. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with

common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides

excellent EM shielding.

Additional benefits include:

• Available on tape and reel

AVAILABLE ON

TAPE & REEL

• Cost effective for commercial wireless applications

• Industry standard size

• Temperature stable from –65 to +125 degrees C.

• Can be integrated with other Multi-Mix^®components in a multi-function module

RELIABILITY

All CSD series components are 100% tested. The product family has passed environmental screening

per MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture

Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).

THE MULTI-MIX^®PROCESS

Multi-Mix^®is a manufacturing process based on fluoropolymer composite substrates that are fusion

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-

lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded

multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plat-

ed-through vias to form a SMD module that requires no additional packaging and is ready for pick and

place.

THE MULTI-MIX MICROTECHNOLOGY^®GROUP IS ISO-9001 REGISTERED

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

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