Datasheet > 射频和微波 > 射频/微波耦合器> CSD-10Z-3.5G

CSD-10Z-3.5G

更新时间： 2024-02-09 11:55:05

品牌	Logo	应用领域
MERRIMAC		射频和微波射频耦合器微波耦合器
页数	文件大小	规格书
5页	217K
描述
DIRECTIONAL COUPLERS

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CSD-10Z-3.5G 技术参数

生命周期：	Contact Manufacturer	包装说明：	SURFACE MOUNT PACKAGE-4
Reach Compliance Code：	compliant	风险等级：	5.84
构造：	COMPONENT	最大输入功率 (CW)：	50 dBm
最大插入损耗：	0.2 dB	最大工作频率：	3700 MHz
最小工作频率：	3300 MHz	最高工作温度：	85 °C
最低工作温度：	-55 °C	射频/微波设备类型：	DIRECTIONAL COUPLER
最大电压驻波比：	1.3

CSD-10Z-3.5G 数据手册

CSD-10Z-3.5G

DIRECTIONAL COUPLERS

REV: 001, 06/20/02

• 3.3 - 3.7 GHz

• HIGH POWER…100 WATTS CW

• LOW LOSS

• LOW VSWR

• SURFACE MOUNT

• TAPE & REEL

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX PICO™ Z-SERIES DIRECTIONAL COUPLERS

The Multi-Mix^®CSD-Z series provides directional couplers with low insertion loss, low VSWR, and high

power handling in a small outline. Precise coupling and frequency sensitivity make them ideal for

applications involving power amplifiers, signal distribution and processing.

CSD-Z directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding

process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical

performance that is superior to conventional adhesive bonding techniques.

The CSD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless

applications. The high stability ceramic filled PTFE dielectrics utilized in these components are

compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground

plane provides excellent EM shielding.

Additional benefits include:

• Small outline size

AVAILABLE ON

TAPE & REEL

• High power…100 Watts CW

• Cost effective for commercial wireless applications

• Operating temperature range –55°C to +85°C.

• Available on tape and reel

• Can be integrated with other Multi-Mix^®components in a multi-function module

RELIABILITY

The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,

Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life

Test (>1000 cycles).

THE MULTI-MIX^®PROCESS

Multi-Mix^®is a manufacturing process based on fluoropolymer composite substrates that are fusion

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous

monolithic structure with superior performance at microwave and millimeter wave frequencies. The

bonded multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns,

and plated-through vias to form a SMD module that requires no additional packaging and is suitable for

automated assembly.

THE MULTI-MIX MICROTECHNOLOGY^®GROUP IS ISO-9001 REGISTERED

U.S. patent 6,099,677 and other patents pending.

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

12 3 4 5

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