生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | TFBGA, | 针数: | 115 |
Reach Compliance Code: | unknown | 风险等级: | 5.82 |
其他特性: | IT ALSO REQUIRES 3.3V I/O SUPPLY | JESD-30 代码: | R-PBGA-B115 |
长度: | 12 mm | 端子数量: | 115 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压: | 1.95 V | 最小供电电压: | 1.65 V |
标称供电电压: | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 宽度: | 9 mm |
uPs/uCs/外围集成电路类型: | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MD2534-D1G-X-P | SANDISK |
功能相似 |
Flash Memory Drive, CMOS, PBGA115, 12 X 9 MM, 1.20 MM HEIGHT, FBGA-115 | |
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