MCTL300N10Y
Features
•
•
•
Split Gate Trench MOSFET Technology
Excellent Package for Heat Dissipation
High Density Cell Design for Low RDS(on)
•
•
•
Halogen Free Available Upon Request By Adding Suffix "-HF"
Epoxy Meets UL 94 V-0 Flammability Rating
N-CHANNEL
MOSFET
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
Maximum Ratings
•
•
•
•
Operating Junction Temperature Range : -55°C to +150°C
Storage Temperature Range: -55°C to +150°C
TOLL-8L
Thermal Resistance: 40°C/W Junction to Ambient (1)
Thermal Resistance: 0.25°C/W Junction to Case (1)
H
A
C
9
Q
θ
Parameter
Rating
100
Symbol
VDS
Unit
V
G
F
K
Drain-Source Voltage
Gate-Source Volltage
O
VGS
±20
V
θ
1
2
3
4
5
6
7
8
R
J
E
B
TC=25°C
300
A
I
D
ID
Continuous Drain Current
S
P
TC=100°C
267
A
θ
θ
M
N
Pulsed Drain Current (2)
Total Power Dissipation
IDM
PD
1200
500
A
W
mJ
L
Single Pulsed Avalanche Energy(3)
Note:
EAS
800
DIMENSIONS
INCHES MM
MIN MAX
1.Surface Mounted on Minimum Footprint Pad Area.
2.Pulse Test: Pulse Width≤10µs,Duty Cycle ≤1%.
3.TJ=25°C, L=1.0mH, VDD=50V.
DIM
NOTE
MIN
MAX
2.40
0.90
9.90
0.50
0.60
A
B
C
D
E
F
G
H
I
0.087 0.094 2.20
0.028 0.035 0.70
0.382 0.390 9.70
0.017 0.020 0.42
0.016 0.024 0.40
Internal Structure and Marking Code
D
0.405 0.417 10.28 10.58
0.122 0.138 3.10 3.50
0.382 0.398 9.70 10.10
0.311 0.327 7.90 8.30
0.047 1.20
0.452 0.468 11.48 11.88
MCC
1. GATE
MCTL300N10Y
2,3,4,5,6,7,8. SOURCE
9. DRAIN
G
J
BSC
K
L
0.266 0.281 6.75
7.15
S
0.315
8.00
M
N
O
P
Q
R
S
θ
8
2
PIN 1
0.118 0.130 3.00
0.157 0.172 3.98
0.055 0.071 1.40
0.024 0.031 0.60
0.020 0.028 0.50
0.039 0.051 1.00
3.30
4.38
1.80
0.80
0.70
1.30
10°
4°
10°
4°
Rev.3-4-08022023
1/5
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