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MCR12DCM PDF预览

MCR12DCM

更新时间: 2024-09-14 04:16:23
品牌 Logo 应用领域
安森美 - ONSEMI 可控硅整流器
页数 文件大小 规格书
5页 64K
描述
Silicon Controlled Rectifiers Reverse Blocking Thyristors

MCR12DCM 数据手册

 浏览型号MCR12DCM的Datasheet PDF文件第2页浏览型号MCR12DCM的Datasheet PDF文件第3页浏览型号MCR12DCM的Datasheet PDF文件第4页浏览型号MCR12DCM的Datasheet PDF文件第5页 
MCR12DCM, MCR12DCN  
Preferred Device  
Silicon Controlled Rectifiers  
Reverse Blocking Thyristors  
Designed for high volume, low cost, industrial and consumer  
applications such as motor control; process control; temperature, light  
and speed control.  
http://onsemi.com  
Features  
SCRs  
12 AMPERES RMS  
600 − 800 VOLTS  
Small Size  
Passivated Die for Reliability and Uniformity  
Low Level Triggering and Holding Characteristics  
Epoxy Meets UL 94 V−0 @ 0.125 in  
ESD Ratings: Human Body Model, 3B u 8000 V  
Machine Model, C u 400 V  
G
A
K
Pb−Free Packages are Available  
4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
Unit  
2
1
3
Peak Repetitive Off−State Voltage (Note 1)  
V
DRM,  
V
(T = −40 to 125°C, Sine Wave, 50 to 60 Hz,  
V
RRM  
J
Gate Open)  
MCR12DCM  
MCR12DCN  
600  
800  
DPAK  
CASE 369C  
STYLE 4  
On−State RMS Current  
I
12  
7.8  
100  
A
A
A
T(RMS)  
(180° Conduction Angles; T = 90°C)  
C
Average On−State Current  
I
T(AV)  
MARKING DIAGRAM  
(180° Conduction Angles; T = 90°C)  
C
Peak Non-Repetitive Surge Current  
I
TSM  
(1/2 Cycle, Sine Wave 60 Hz, T = 125°C)  
J
YWW  
R1  
2
2
Circuit Fusing Consideration (t = 8.3 msec)  
I t  
41  
A sec  
2DCxG  
Forward Peak Gate Power  
P
5.0  
W
W
A
GM  
(Pulse Width 1.0 sec, T = 90°C)  
C
Forward Average Gate Power  
P
G(AV)  
0.5  
2.0  
Y
WW  
= Year  
= Work Week  
R12DCx = Device Code  
x= M or N  
(t = 8.3 msec, T = 90°C)  
C
Forward Peak Gate Current  
I
GM  
(Pulse Width 1.0 sec, T = 90°C)  
C
G
= Pb−Free Package  
Operating Junction Temperature Range  
Storage Temperature Range  
T
40 to 125  
40 to 150  
°C  
°C  
J
T
stg  
PIN ASSIGNMENT  
Cathode  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1
2
3
4
Anode  
Gate  
1. V  
for all types can be applied on a continuous basis. Ratings apply for zero  
DRM  
or negative gate voltage; positive gate voltage shall not be applied concurrent  
with negative potential on the anode. Blocking voltages shall not be tested  
with a constant current source such that the voltage ratings of the device are  
exceeded.  
Anode  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 5  
MCR12DCM/D  
 

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