MCP9701

更新时间： 2024-11-27 21:55:27

品牌	Logo	应用领域
美国微芯 - MICROCHIP		传感器温度传感器
页数	文件大小	规格书
18页	266K
描述
Low-Power Voltage Output Temperature Sensor

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

MCP9701 技术参数

生命周期：	Active	包装说明：	TSSOP5/6,.08
Reach Compliance Code：	compliant	风险等级：	5.81
安装特点：	SURFACE MOUNT	端子数量：	5
最大工作电流：	0.012 mA	最高工作温度：	125 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装等效代码：	TSSOP5/6,.08	封装形状/形式：	RECTANGULAR
电源：	3.3/5 V	子类别：	Other Sensors
表面贴装：	YES	温度系数：	NEGATIVE/POSITIVE ppm/ °C
Base Number Matches：	1

MCP9701 数据手册

MCP9700/01

Low-Power Voltage Output Temperature Sensor

Description

Features

• Tiny Analog Temperature Sensor

• Available Packages: SC70-5

• Wide Temperature Measurement Range:

- -40°C to +125°C

The MCP9700/01 low-cost, low-power and tiny tem-

perature sensor family converts temperature to an

analog voltage. It provides an accuracy of ±4°C from

0°C to +70°C while consuming 6 µA (typ.) of operating

current.

• Accuracy: ±4°C (max.), 0°C to +70°C

The MCP9700/01 provides a low-cost solution for

applications that require measurement of a relative

change of temperature. When measuring relative

change in temperature from 25°C, an accuracy of

±1°C (typ.) can be realized from 0°C to 70°C. This

accuracy can also be achieved by applying system

calibration at 25°C.

• Optimized for Analog-to-Digital Converters

(ADCs):

- MCP9700: 10.0 mV/°C (typ.)

- MCP9701: 19.5 mV/°C (typ.)

• Wide Operating Voltage Range:

- MCP9700: V_DD= 2.3V to 5.5V

- MCP9701: V_DD= 3.1V to 5.5V

• Low Operating Current: 6 µA (typ.)

• Optimized to Drive Large Capacitive Loads

Unlike resistive sensors such as thermistors, this

family does not require a signal conditioning circuit.

The voltage output pin can be directly connected to an

ADC input of a microcontroller. The MCP9700 and

MCP9701 temperature coefficients are scaled to

provide a 1° C/bit resolution for an 8-bit ADC with a

reference voltage of 2.5V and 5V, respectively.

Typical Applications

• Hard Disk Drives and Other PC Peripherals

• Entertainment Systems

In addition, this family is immune to the effects of

parasitic capacitance and can drive large capacitive

loads. This provides Printed Circuit Board (PCB) layout

design flexibility by enabling the device to be remotely

located from the microcontroller. Adding some

capacitance at the output also helps the output

transient response by reducing overshoots or

undershoots. However, capacitive load is not required

for sensor output stability.

• Home Appliance

• Office Equipment

• Battery Packs and Portable Equipment

• General Purpose Temperature Monitoring

Package Type

SC70-5

GND 2

V_OUT

V_DD

Typical Application Circuit

PICmicro^®

Microcontroller

V_DD

MCP9700/01

V_DD

10 kΩ

ANI

C_bypass

0.1 µF

V_OUT

MCLR

V_SS

GND

DS21942A-page 1

12 3 4 5 6 7...18

中文翻译

下载PDF

与MCP9701相关器件

型号	品牌	获取价格	描述	数据表
MCP9701A	MICROCHIP	获取价格	Low-Power Linear Active Thermistor⑩ ICs
MCP9701A-E/LT	MICROCHIP	获取价格	Low-Power Linear Active Thermistor⑩ ICs
MCP9701A-E/TO	MICROCHIP	获取价格	Low-Power Linear Active Thermistor⑩ ICs
MCP9701A-E/TT	MICROCHIP	获取价格	Low-Power Linear Active Thermistorâ¢ ICs
MCP9701A-H/LT	MICROCHIP	获取价格	Low-Power Linear Active Thermistorâ¢ ICs
MCP9701A-H/TO	MICROCHIP	获取价格	Low-Power Linear Active Thermistorâ¢ ICs
MCP9701A-H/TT	MICROCHIP	获取价格	Low-Power Linear Active Thermistorâ¢ ICs
MCP9701AT	MICROCHIP	获取价格	Low-Power Linear Active Thermistorâ¢ ICs
MCP9701AT-E	MICROCHIP	获取价格	Low-Power Linear Active Thermistor ICs
MCP9701AT-E/LT	MICROCHIP	获取价格	Low-Power Linear Active Thermistor⑩ ICs

与MCP9701相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

47
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

35
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

65
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

61

产品中心

服务支持

精选活动

关于我们

帮助中心

MCP9701

MCP9701 技术参数

MCP9701 数据手册

与MCP9701相关器件

与MCP9701相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MCP9701

MCP9701 技术参数

MCP9701 数据手册

与MCP9701相关器件

与MCP9701相关文章

您还可以找

您在本页遇到什么问题？