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MCP652-E/UN PDF预览

MCP652-E/UN

更新时间: 2024-11-22 11:04:39
品牌 Logo 应用领域
美国微芯 - MICROCHIP 运算放大器放大器电路光电二极管
页数 文件大小 规格书
44页 1232K
描述
50 MHz, 6 mA Op Amps with mCal

MCP652-E/UN 技术参数

生命周期:Active零件包装代码:MSOP
包装说明:TSSOP,针数:10
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.68
Is Samacsys:N放大器类型:OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB):0.005 µA标称共模抑制比:81 dB
最大输入失调电压:200 µVJESD-30 代码:S-PDSO-G10
长度:3 mm功能数量:2
端子数量:10最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装形状:SQUARE
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH认证状态:Not Qualified
座面最大高度:1.1 mm标称压摆率:30 V/us
供电电压上限:6.5 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
标称均一增益带宽:50000 kHz宽度:3 mm
Base Number Matches:1

MCP652-E/UN 数据手册

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MCP651/2/5  
50 MHz, 6 mA Op Amps with mCal  
Features  
Description  
• Gain Bandwidth Product: 50 MHz (typical)  
• Short Circuit Current: 100 mA (typical)  
• Noise: 7.5 nV/Hz (typical, at 1 MHz)  
• Calibrated Input Offset: ±200 µV (maximum)  
• Rail-to-Rail Output  
The Microchip Technology, Inc. MCP651/2/5 family of  
operational amplifiers features low offset. At power up,  
these op amps are self-calibrated using mCal. Some  
package options also provide a calibration/chip select  
pin (CAL/CS) that supports a low power mode of oper-  
ation, with offset calibration at the time normal opera-  
tion is re-started. These amplifiers are optimized for  
high speed, low noise and distortion, single-supply  
operation with rail-to-rail output and an input that  
includes the negative rail.  
• Slew Rate: 30 V/µs (typical)  
• Supply Current: 6.0 mA (typical)  
• Power Supply: 2.5V to 5.5V  
• Extended Temperature Range: -40°C to +125°C  
This family is offered in single with CAL/CS pin  
(MCP651), dual (MCP652) and dual with CAL/CS pins  
(MCP655). All devices are fully specified from -40°C to  
+125°C.  
Typical Applications  
• Driving A/D Converters  
• Power Amplifier Control Loops  
• Barcode Scanners  
Typical Application Circuit  
• Optical Detector Amplifier  
R1  
R2  
VDD/2  
VOUT  
RL  
Design Aids  
R3  
• SPICE Macro Models  
• FilterLab® Software  
MCP65X  
VIN  
• Mindi™ Circuit Designer & Simulator  
• Microchip Advanced Part Selector (MAPS)  
• Analog Demonstration and Evaluation Boards  
• Application Notes  
Power Driver with High Gain  
Package Types  
MCP651  
MCP652  
MCP655  
SOIC  
3×3 DFN *  
3×3 DFN *  
1
2
3
4
8
7
6
5
NC  
CAL/CS  
VDD  
VOUTA  
V
DD  
VOUTA  
VDD  
1
2
3
10  
9
1
8
7
VIN  
+
VINA  
+
VOUTB  
VINA  
+
VOUTB  
2
EP  
9
EP  
11  
VIN  
VOUT  
VCAL  
VINA  
VINB  
VINB  
+
VINA  
VINB  
VINB  
+
8
3
4
6
5
VSS  
VSS  
VSS  
4
5
7
6
CALA/CSA  
CALB/CSB  
MCP652  
MCP655  
SOIC  
MSOP  
VDD  
8
V
DD  
VOUTA  
1
VOUTA  
1
10  
VOUTB  
VINA  
VOUTB  
2
3
4
7
6
5
2
3
9
8
7
6
VINA  
+
VINA  
+
VINB  
VINB  
+
VINA  
VINB  
VINB  
+
VSS 4  
CALA/CSA  
VSS  
CALB/CSB  
5
* Includes Exposed Thermal Pad (EP); see Table 3-1.  
© 2009 Microchip Technology Inc.  
DS22146A-page 1  

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