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MCP632

更新时间: 2024-11-23 11:04:43
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美国微芯 - MICROCHIP 运算放大器
页数 文件大小 规格书
42页 789K
描述
24 MHz, 2.5 mA Op Amps

MCP632 数据手册

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MCP631/2/3/5  
24 MHz, 2.5 mA Op Amps  
Features  
Description  
• Gain Bandwidth Product: 24 MHz (typical)  
• Short Circuit Current: 70 mA (typical)  
• Noise: 10 nV/Hz (typical, at 1 MHz)  
• Rail-to-Rail Output  
The Microchip Technology, Inc. MCP631/2/3/5 family of  
operational amplifiers features high gain bandwidth  
product (24 MHz, typical) and high output short circuit  
current (70 mA, typical). Some also provide a Chip  
Select pin (CS) that supports a low power mode of  
operation. These amplifiers are optimized for high  
speed, low noise and distortion, single-supply  
operation with rail-to-rail output and an input that  
includes the negative rail.  
• Slew Rate: 10 V/µs (typical)  
• Supply Current: 2.5 mA (typical)  
• Power Supply: 2.5V to 5.5V  
• Extended Temperature Range: -40°C to +125°C  
This family is offered in single (MCP631), single with  
CS pin (MCP633), dual (MCP632) and dual with  
two CS pins (MCP635). All devices are fully specified  
from -40°C to +125°C.  
Typical Applications  
• Driving A/D Converters  
• Power Amplifier Control Loops  
• Barcode Scanners  
Typical Application Circuit  
• Optical Detector Amplifier  
R1  
R2  
VDD/2  
VOUT  
RL  
Design Aids  
R3  
• SPICE Macro Models  
• FilterLab® Software  
VIN  
MCP63X  
• Mindi™ Circuit Designer & Simulator  
• Microchip Advanced Part Selector (MAPS)  
• Analog Demonstration and Evaluation Boards  
• Application Notes  
Power Driver with High Gain  
Package Types  
MCP633  
MCP631  
MCP632  
MCP635  
SOIC  
SOIC  
SOIC  
MSOP  
VDD  
V
DD  
VOUTA  
1
8
7
6
5
1
8
7
6
5
1
8
7
6
5
VOUTA  
1
2
3
10  
9
NC  
CS  
NC  
NC  
VOUTB  
VINA  
+
VOUTB  
2
3
4
2
3
4
2
3
4
VINA  
+
VIN  
+
VDD  
VOUT  
NC  
VIN  
+
VDD  
VOUT  
NC  
VINA  
VINB  
VINB  
+
VINA  
VINB  
VINB  
+
8
VIN  
VIN  
VSS 4  
VSS  
7
VSS  
VSS  
CSA  
5
CSB  
6
MCP632  
3x3 DFN *  
MCP635  
3x3 DFN *  
1
2
3
4
5
10  
VDD  
VOUTA  
VDD  
VOUTA  
1
8
7
6
5
VINA  
VINA  
+
VOUTB  
9
8
7
6
VINA  
VINA  
VSS  
VOUTB  
2
3
4
VINB  
VINB  
+
+
VINB  
VINB  
+
VSS  
CSA  
CSB  
* Includes Exposed Thermal Pad (EP); see Table 3-1.  
© 2009 Microchip Technology Inc.  
DS22197A-page 1  

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