MCP6231/1R/1U/2/4
20 µA, 300 kHz Rail-to-Rail Op Amp
Description
Features
The Microchip Technology Inc. MCP6231/1R/1U/2/4
operational amplifiers (op amps) provide wide
bandwidth for the quiescent current. The MCP6231/1R/
1U/2/4 family has a 300 kHz gain bandwidth product
and 65°C (typical) phase margin. This family operates
from a single supply voltage as low as 1.8V, while
drawing 20 µA (typical) quiescent current. In addition,
the MCP6231/1R/1U/2/4 family supports rail-to-rail
input and output swing, with a common mode input
voltage range of VDD + 300 mV to VSS – 300 mV.
These op amps are designed in one of Microchip’s
advanced CMOS processes.
• Gain Bandwidth Product: 300 kHz (typical)
• Supply Current: IQ = 20 µA (typical)
• Supply Voltage: 1.8V to 6.0V
• Rail-to-Rail Input/Output
• Extended Temperature Range: -40°C to +125°C
• Available in 5-Pin SC70 and SOT-23 packages
Applications
• Automotive
• Portable Equipment
• Transimpedance amplifiers
• Analog Filters
Package Types
MCP6231
MCP6231
• Notebooks and PDAs
• Battery-Powered Systems
MSOP, PDIP, SOIC
SOT-23-5
1
2
3
4
8
7
6
5
NC
NC
V
V
V
1
2
3
5
4
DD
OUT
V
–
+
–
+
DD
IN
V
Design Aids
SS
+
–
V
V
OUT
IN
V
V
–
IN
IN
• SPICE Macro Models
• FilterLab® Software
V
NC
SS
MCP6232
MSOP, PDIP, SOIC
MCP6231R
• Mindi™ Circuit Designer & Simulator
• Microchip Advanced Part Selector (MAPS)
• Analog Demonstration and Evaluation Boards
• Application Notes
SOT-23-5
VOUTA
V
V
VDD
8
7
6
5
1
2
1
5
4
SS
OUT
_
V
VINA
2
3
-
VOUTB
DD
+
+
–
_
V
V –
IN
VINA+ 3
+
-
IN
VINB
Typical Application
VSS
4
VINB
+
RG2
MCP6232
MCP6231U
SC70-5, SOT-23-5
VIN2
VIN1
2x3 TDFN *
RG1
VDD
VOUTA
1
2
8
7
V
V
+
1
2
3
5
DD
IN
+
RF
_
VINA
VOUTB
EP
9
V
SS
–
_
VDD
VINA+
VINB
3
4
6
5
V
–
V
OUT
4
IN
–
VSS
VINB+
RX
RY
VOUT
MCP6231
+
MCP6231
DFN *
MCP6234
PDIP, SOIC, TSSOP
RZ
NC
1
2
8
NC
VOUTA
14 VOUTD
1
2
3
4
VINA
–
+
- + + 13 VIND
-
–
+
V
–
V
7
EP
9
IN
DD
VINA
12 VIND
V
+
V
3
4
6
5
IN
OUT
VDD
VSS
11
VSS
NC
Summing Amplifier Circuit
VINB
+
–
10 VINC
-
9 VINC
+
–
5
6
7
-
+ +
VINB
VOUTB
8 VOUTC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
© 2009 Microchip Technology Inc.
DS21881E-page 1