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MCP622

更新时间: 2024-09-24 11:04:47
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美国微芯 - MICROCHIP 运算放大器
页数 文件大小 规格书
44页 825K
描述
20 MHz, 2.5 mA Op Amps with mCal

MCP622 数据手册

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MCP621/2/5  
20 MHz, 2.5 mA Op Amps with mCal  
Features  
Description  
• Gain Bandwidth Product: 20 MHz (typical)  
• Short Circuit Current: 70 mA (typical)  
• Noise: 13 nV/Hz (typical, at 1 MHz)  
• Calibrated Input Offset: ±200 µV (maximum)  
• Rail-to-Rail Output  
The Microchip Technology, Inc. MCP621/2/5 family of  
operational amplifiers features low offset. At power up,  
these op amps are self-calibrated using mCal. Some  
package options also provide a calibration/chip select  
pin (CAL/CS) that supports a low power mode of  
operation, with offset calibration at the time normal  
operation is re-started. These amplifiers are optimized  
for high speed, low noise and distortion, single-supply  
operation with rail-to-rail output and an input that  
includes the negative rail.  
• Slew Rate: 10 V/µs (typical)  
• Supply Current: 2.5 mA (typical)  
• Power Supply: 2.5V to 5.5V  
• Extended Temperature Range: -40°C to +125°C  
This family is offered in single with CAL/CS pin  
(MCP621), dual (MCP622) and dual with CAL/CS pins  
(MCP625). All devices are fully specified from -40°C to  
+125°C.  
Typical Applications  
• Driving A/D Converters  
• Power Amplifier Control Loops  
• Barcode Scanners  
Typical Application Circuit  
• Optical Detector Amplifier  
R1  
R2  
VDD/2  
VOUT  
RL  
Design Aids  
R3  
• SPICE Macro Models  
• FilterLab® Software  
MCP62X  
VIN  
• Mindi™ Circuit Designer & Simulator  
• Microchip Advanced Part Selector (MAPS)  
• Analog Demonstration and Evaluation Boards  
• Application Notes  
Power Driver with High Gain  
Package Types  
MCP621  
MCP622  
MCP625  
SOIC  
3x3 DFN *  
3x3 DFN *  
1
2
3
4
8
7
6
5
NC  
CAL/CS  
VDD  
VOUTA  
V
DD  
VOUTA  
VDD  
1
2
3
10  
9
1
8
7
VIN  
+
VINA  
+
VOUTB  
VINA  
+
VOUTB  
2
EP  
9
EP  
11  
VIN  
VOUT  
VCAL  
VINA  
VINB  
VINB  
+
VINA  
VINB  
VINB  
+
8
3
4
6
5
VSS  
VSS  
VSS  
4
5
7
6
CALA/CSA  
CALB/CSB  
MCP622  
MCP625  
SOIC  
MSOP  
VDD  
8
V
DD  
VOUTA  
1
VOUTA  
1
10  
VOUTB  
VINA  
VOUTB  
2
3
4
7
6
5
2
3
9
8
7
6
VINA  
+
VINA  
+
VINB  
VINB  
+
VINA  
VINB  
VINB  
+
VSS 4  
CALA/CSA  
VSS  
CALB/CSB  
5
* Includes Exposed Thermal Pad (EP); see Table 3-1.  
© 2009 Microchip Technology Inc.  
DS22188A-page 1  

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