MCP608-I/OT

更新时间： 2024-11-04 13:11:23

品牌	Logo	应用领域
美国微芯 - MICROCHIP		运算放大器
页数	文件大小	规格书
32页	480K
描述
OP-AMP, PDSO5, PLASTIC, SOT-23, 5 PIN

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

MCP608-I/OT 技术参数

生命周期：	Active	零件包装代码：	SOT-23
包装说明：	PLASTIC, SOT-23, 5 PIN	针数：	5
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.33.00.01	风险等级：	5.65
放大器类型：	OPERATIONAL AMPLIFIER	JESD-30 代码：	R-PDSO-G5
端子数量：	5	封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
认证状态：	Not Qualified	表面贴装：	YES
端子形式：	GULL WING	端子位置：	DUAL
Base Number Matches：	1

MCP608-I/OT 数据手册

MCP606/7/8/9

2.5V to 6.0V Micropower CMOS Op Amp

Description

Features

The MCP606/7/8/9 family of operational amplifiers (op

amps) from Microchip Technology Inc. are unity-gain

stable with low offset voltage (250 µV, maximum).

Performance characteristics include rail-to-rail output

swing capability and low input bias current (80 pA at

+85°C, maximum). These features make this family of

op amps well suited for single-supply, precision,

high-impedance, battery-powered applications.

• Low Input Offset Voltage: 250 µV (maximum)

• Rail-to-Rail Output

• Low Input Bias Current: 80 pA (maximum at

+85°C)

• Low Quiescent Current: 25 µA (maximum)

• Power Supply Voltage: 2.5V to 6.0V

• Unity-Gain Stable

• Chip Select (CS) Capability: MCP608

• Industrial Temperature Range: -40°C to +85°C

• No Phase Reversal

The single is available in standard 8-lead PDIP, SOIC

and TSSOP packages, as well as in a SOT-23-5

package. The single MCP608 with Chip Select (CS) is

offered in the standard 8-lead PDIP, SOIC and TSSOP

packages. The dual MCP607 is offered in the standard

8-lead PDIP, SOIC and TSSOP packages. Finally, the

quad MCP609 is offered in the standard 14-lead PDIP,

SOIC and TSSOP packages. All devices are fully

specified from -40°C to +85°C, with power supplies

from 2.5V to 6.0V.

• Available in Single, Dual and Quad Packages

Typical Applications

• Battery Power Instruments

• High-Impedance Applications

• Strain Gauges

• Medical Instruments

• Test Equipment

Package Types

MCP606

PDIP, SOIC,TSSOP

MCP606

SOT-23-5

Design Aids

NC 1

V_OUT

V_SS

V_IN+

V_DD

• SPICE Macro Models

• FilterLab^®Software

V_IN–

V_IN+

V_SS

V_DD

V_OUT

V_IN–

• Mindi™ Circuit Designer & Simulator

• Analog Demonstration and Evaluation Boards

• Application Notes

5 NC

MCP607

PDIP, SOIC,TSSOP

MCP608

PDIP, SOIC,TSSOP

Typical Application

V_OUTA

NC 1

V_DD

V_INA

–

V_OUTBV_IN–

V_DD

V_OUT

V_OUT= V_LM+ I R

(R ⁄ R_G)

SEN

I_L

V_INB

–

V_IN+

V_SS

5 V_INB

5 NC

V_SS

R_F

R_G

To Load

(V_LP

)

50 kΩ

MCP609

PDIP, SOIC,TSSOP

5 kΩ

2.5V

6.0V

V_OUTA

V_OUTD

V_OUT

V_INA

–

V_IND

–

MCP606

R_SEN

10Ω

To Load

11 V_SS

(V_LM

)

V_DD

V_INB

–

V_INC

–

Low-Side Battery Current Sensor

8 V_OUTC

V_OUTB

DS11177E-page 1

12 3 4 5 6 7...32

中文翻译

下载PDF

与MCP608-I/OT相关器件

型号	品牌	获取价格	描述	数据表
MCP608I/P	MICROCHIP	获取价格	2.5V TO 5.5V MICROPOWER CMOS OP AMPS
MCP608-I/P	MICROCHIP	获取价格	OP-AMP, 250 uV OFFSET-MAX, 0.155 MHz BAND WIDTH, PDIP8, 0.300 INCH, PLASTIC, DIP-8
MCP608I/SL	MICROCHIP	获取价格	2.5V TO 5.5V MICROPOWER CMOS OP AMPS
MCP608-I/SL	MICROCHIP	获取价格	OP-AMP, PDSO14, 3.90 MM, PLASTIC, SOIC-14
MCP608I/SN	MICROCHIP	获取价格	2.5V TO 5.5V MICROPOWER CMOS OP AMPS
MCP608-I/SN	MICROCHIP	获取价格	2.5V to 6.0V Micropower CMOS Op Amp
MCP608I/ST	MICROCHIP	获取价格	2.5V TO 5.5V MICROPOWER CMOS OP AMPS
MCP608-I/ST	MICROCHIP	获取价格	OP-AMP, 250 uV OFFSET-MAX, 0.155 MHz BAND WIDTH, PDSO8, 4.40 MM, PLASTIC, TSSOP-8
MCP608-ISN	MICROCHIP	获取价格	2.5V to 6.0V Micropower CMOS Op Amp
MCP608T	MICROCHIP	获取价格	2.5V to 6.0V Micropower CMOS Op Amp

与MCP608-I/OT相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

13
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

7
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

33
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

30

产品中心

服务支持

精选活动

关于我们

帮助中心

MCP608-I/OT

MCP608-I/OT 技术参数

MCP608-I/OT 数据手册

与MCP608-I/OT相关器件

与MCP608-I/OT相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MCP608-I/OT

MCP608-I/OT 技术参数

MCP608-I/OT 数据手册

与MCP608-I/OT相关器件

与MCP608-I/OT相关文章

您还可以找

您在本页遇到什么问题？