MCP6071/2/4
110 µA, High Precision Op Amps
Features
Description
• Low Offset Voltage: ±150 µV (maximum)
• Low Quiescent Current: 110 µA (typical)
• Rail-to-Rail Input and Output
The Microchip Technology Inc. MCP6071/2/4 family of
operational amplifiers (op amps) has low input offset
voltage (±150 µV, maximum) and rail-to-rail input and
output operation. This family is unity gain stable and
has a gain bandwidth product of 1.2 MHz (typical).
These devices operate with a single supply voltage as
low as 1.8V, while drawing low quiescent current per
amplifier (110 µA, typical). These features make the
family of op amps well suited for single-supply, high
precision, battery-powered applications.
• Wide Supply Voltage Range: 1.8V to 6.0V
• Gain Bandwidth Product: 1.2 MHz (typical)
• Unity Gain Stable
• Extended Temperature Range: -40°C to +125°C
• No Phase Reversal
The MCP6071/2/4 family is offered in single
(MCP6071), dual (MCP6072), and quad (MCP6074)
configurations.
Applications
• Automotive
• Portable Instrumentation
• Sensor Conditioning
• Battery Powered Systems
• Medical Instrumentation
• Test Equipment
The MCP6071/2/4 is designed with Microchip’s
advanced CMOS process. All devices are available in
the extended temperature range, with a power supply
range of 1.8V to 6.0V.
Package Types
• Analog Filters
MCP6071
SOIC
MCP6072
SOIC
Design Aids
NC
V
V
1
8
7
6
5
1
2
3
4
8
NC
V
OUTA
DD
• SPICE Macro Models
V
V
V
• FilterLab® Software
2
3
4
7
6
5
V
–
+
V
–
INA
DD
OUTB
IN
V
–
V
V
+
INA
OUT
INB
IN
• MAPS (Microchip Advanced Part Selector)
• Analog Demonstration and Evaluation Boards
• Application Notes
NC
+
V
V
INB
SS
SS
MCP6072
2x3 TDFN
MCP6071
2x3 TDFN
Typical Application
NC
V
OUTA
1
8
7
1
2
8
NC
V
V
V
DD
V
–
+
V
–
INA
V
2
7
IN
DD
OUTB
EP
9
EP
9
RL
V
V
+
INA
V
–
IN
3
4
6
5
3
4
6
5
OUT
INB
V
V
NC
V
+
VOUT
SS
SS
INB
ZIN
MCP6071
MCP6074
SOIC, TSSOP
MCP6071
SOT-23-5
C
V
1
2
3
4
5
6
7
14
13
12
11
10
9
V
OUTD
OUTA
V
1
2
3
5
V
OUT
DD
V
V
V
–
ZIN = RL + jωL
L = RLRC
R
V
–
IND
V
INA
SS
+
V
+
Gyrator
IND
INA
V
–
V
+
4
IN
IN
V
SS
DD
V
V
V
+
V
V
+
INC
INB
–
–
INB
INC
8
V
OUTC
OUTB
* Includes Exposed Thermal Pad (EP); see Table 3-1.
© 2010 Microchip Technology Inc.
DS22142B-page 1