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MCP48CVB12 PDF预览

MCP48CVB12

更新时间: 2024-11-28 02:47:07
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美国微芯 - MICROCHIP /
页数 文件大小 规格书
106页 8854K
描述
8/10/12-Bit Digital-to-Analog Converters, 1 LSb INL Single/Dual Voltage Outputs with SPI Interface

MCP48CVB12 数据手册

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MCP48CXBXX  
8/10/12-Bit Digital-to-Analog Converters, 1 LSb INL  
Single/Dual Voltage Outputs with SPI Interface  
Features  
Package Types  
• Memory Options:  
MCP48CXBX1 (Single)  
- Volatile Memory: MCP48CVBXX  
- Nonvolatile Memory: MCP48CMBXX  
• Operating Voltage Range:  
MSOP-10, DFN-10 (3 x 3)  
V
DD  
1
2
3
10  
SDI  
CS  
REF  
OUT  
- 2.7V to 5.5V – Full specifications  
- 1.8V to 2.7V – Reduced device specifications  
• Output Voltage Resolutions:  
9 SCK  
V
SDO  
8
V
4
7 V  
SS  
-
8-Bit: MCP48CXB0X (256 steps)  
NC 5  
6 LAT/HVC  
- 10-Bit: MCP48CXB1X (1024 steps)  
- 12-Bit: MCP48CXB2X (4096 steps)  
• Nonvolatile Memory (MTP) Size: 32 Locations  
• 1 LSb Integral Nonlinearity (INL) Specification  
• DAC Voltage Reference Source Options:  
- Device VDD  
QFN-16 (3 x 3)  
CS  
1
2
3
4
12  
SCK  
V
V
11 SDO  
REF  
- External VREF pin (buffered or unbuffered)  
- Internal band gap (1.214V typical)  
• Output Gain Options:  
(1)  
17 EP  
10 V  
OUT  
SS  
NC  
9
LAT/HVC  
- 1x (Unity)  
- 2x (available when not using internal VDD as  
voltage source)  
MCP48CXBX2 (Dual)  
MSOP-10, DFN-10 (3 x 3)  
• Power-on/Brown-out Reset (POR/BOR)  
Protection  
• Power-Down Modes:  
V
DD  
1
2
3
10  
SDI  
- Disconnects output buffer (High-Impedance)  
CS  
9 SCK  
- Selection of VOUT pull-down resistors  
(100 kor 1 k)  
• SPI Interface:  
V
SDO  
8
REF  
V
OUT0  
OUT1  
4
5
7 V  
SS  
(2)  
V
6 LAT/HVC  
- Supports 00’ and ‘11’ modes  
- 50 MHz write speed  
- 25 MHz read speed  
• Package Types:  
QFN-16 (3 x 3)  
- Dual: 16-lead 3 x 3 QFN, 10-lead MSOP,  
10-lead 3 x 3 DFN  
CS  
1
2
3
4
12  
SCK  
- Single: 16-lead 3 x 3 QFN, 10-lead MSOP,  
10-lead 3 x 3 DFN  
V
V
11 SDO  
REF0  
(1)  
17 EP  
10 V  
OUT0  
SS  
• Extended Temperature Range: -40°C to +125°C  
V
9
LAT0/HVC  
REF1  
Note 1: Exposed pad (substrate paddle).  
2: This pin’s signal can be connected to DAC0  
and/or DAC1.  
2019 Microchip Technology Inc.  
DS20006160A-page 1  

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