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MCMA240UI1600PED PDF预览

MCMA240UI1600PED

更新时间: 2024-11-19 14:56:19
品牌 Logo 应用领域
力特 - LITTELFUSE /
页数 文件大小 规格书
7页 487K
描述
三相桥半控和全控系列提供各种封装和高达2200V的击穿电压。

MCMA240UI1600PED 数据手册

 浏览型号MCMA240UI1600PED的Datasheet PDF文件第2页浏览型号MCMA240UI1600PED的Datasheet PDF文件第3页浏览型号MCMA240UI1600PED的Datasheet PDF文件第4页浏览型号MCMA240UI1600PED的Datasheet PDF文件第5页浏览型号MCMA240UI1600PED的Datasheet PDF文件第6页浏览型号MCMA240UI1600PED的Datasheet PDF文件第7页 
MCMA240UI1600PED  
3~  
Rectifier  
Brake  
Chopper  
Thyristor Module  
VRRM  
V V  
CES  
= 1600  
= 1200 V  
A
A
IDAV  
240  
IC25  
180 A  
=
=
=
=
V
1.7  
IFSM  
1500  
VCE(sat)  
3~ Rectifier Bridge, half-controlled (high-side) + Brake Unit  
Part number  
MCMA240UI1600PED  
Backside: isolated  
41-44  
21-22  
32  
35  
38  
T1  
T3  
T5  
17-19  
2-4  
7-9  
12-14  
D2  
D4  
D6  
47-50  
29  
23-25  
E2-Pack  
Features / Advantages:  
Package with DCB ceramic  
Improved temperature and power cycling  
Planar passivated chips  
Applications:  
Package:  
3~ Rectifier with brake unit  
for drive inverters  
Isolation Voltage:  
V~  
3600  
Industry standard outline  
RoHS compliant  
Very low forward voltage drop  
Very low leakage current  
PressFit-Pins for PCB mounting  
Height: 17 mm  
X2PT - 2nd generation Xtreme light Punch Through  
Rugged X2PT design results in:  
- short circuit rated for 10 µsec.  
- very low gate charge  
Base plate: Copper  
internally DCB isolated  
Advanced power cycling  
Phase Change Material available  
- low EMI  
- square RBSOA @ 2x Ic  
Thin wafer technology combined with X2PT design  
results in a competitive low VCE(sat) and low  
thermal resistance  
Disclaimer Notice  
Information furnished is believed to be accurate and reliable. However, users should independently  
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,  
www.littelfuse.com/disclaimer-electronics.  
and may not be used in, all applications. Read complete Disclaimer Notice at  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191220i  
© 2019 IXYS all rights reserved  

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