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MCM69R819AZP8R PDF预览

MCM69R819AZP8R

更新时间: 2024-09-30 20:26:03
品牌 Logo 应用领域
恩智浦 - NXP 信息通信管理静态存储器内存集成电路
页数 文件大小 规格书
20页 367K
描述
256KX18 LATE-WRITE SRAM, 3.5ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119

MCM69R819AZP8R 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:BGA,针数:119
Reach Compliance Code:unknown风险等级:5.54
Is Samacsys:N最长访问时间:3.5 ns
JESD-30 代码:R-PBGA-B119长度:22 mm
内存密度:4718592 bit内存集成电路类型:LATE-WRITE SRAM
内存宽度:18功能数量:1
端子数量:119字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX18封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:2.4 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.15 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:14 mm
Base Number Matches:1

MCM69R819AZP8R 数据手册

 浏览型号MCM69R819AZP8R的Datasheet PDF文件第2页浏览型号MCM69R819AZP8R的Datasheet PDF文件第3页浏览型号MCM69R819AZP8R的Datasheet PDF文件第4页浏览型号MCM69R819AZP8R的Datasheet PDF文件第5页浏览型号MCM69R819AZP8R的Datasheet PDF文件第6页浏览型号MCM69R819AZP8R的Datasheet PDF文件第7页 
Freescale Semiconductor, Inc.  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MCM69R737A/D  
MCM69R737A  
MCM69R819A  
Advance Information  
4M Late Write LVTTL  
TheMCM69R737A/819Aisa4megabitsynchronouslatewritefaststaticRAM  
designed to provide high performance in secondary cache and ATM switch,  
Telecom, and other high speed memory applications. The MCM69R819A  
organized as 256K words by 18 bits, and the MCM69R737A organized as 128K  
words by 36 bits wide are fabricated in Motorola’s high performance silicon gate  
BiCMOS technology.  
The differential CK clock inputs control the timing of read/write operations of  
the RAM. At the rising edge of the CK clock all addresses, write enables, and  
synchronous selects are registered. An internal buffer and special logic enable  
the memory to accept write data on the rising edge of the CK clock a cycle after  
address and control signals. Read data is driven on the rising edge of the CK  
clock also.  
ZP PACKAGE  
PBGA  
CASE 999–01  
The RAM uses LVTTL 3.3 V inputs and outputs.  
The synchronous write and byte enables allow writing to individual bytes or the  
entire word.  
Byte Write Control  
Single 3.3 V + 10%, – 5% Operation  
LVTTL 3.3 V I/O (V  
Register to Register Synchronous Opeation  
Asynchronous Output Enable  
Boundary Scan (JTAG) IEEE 1149.1 Compatible  
Differential Clock Inputs  
Optional x 18 or x 36 organization  
MCM69R737A/819A–5 = 5 ns  
)
DDQ  
MCM69R737A/819A–6 = 6 ns  
MCM69R737A/819A–7 = 7 ns  
MCM69R737A/819A–8 = 8 ns  
Sleep Mode Operation (ZZ Pin)  
119 Bump, 50 mil (1.27 mm) Pitch, 14 mm x 22 mm Plastic Ball Grid Array  
(PBGA) Package  
This document contains information on a new product. Specifications and information herein are subject to change without notice.  
REV 1  
8/13/97  
Motorola, Inc. 1997  
For More Information On This Product,  
Go to: www.freescale.com  

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