是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, |
针数: | 119 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.51 | Is Samacsys: | N |
最长访问时间: | 4 ns | 其他特性: | USER CONFIGURABLE AS 128K X 36 |
JESD-30 代码: | R-PBGA-B119 | JESD-609代码: | e0 |
长度: | 22 mm | 内存密度: | 4718592 bit |
内存集成电路类型: | CACHE SRAM | 内存宽度: | 36 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 119 | 字数: | 131072 words |
字数代码: | 128000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 128KX36 | 输出特性: | 3-STATE |
可输出: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 2.4 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3.135 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 14 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MCM69P817 | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P817ZP2.5 | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P817ZP2.5R | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P817ZP3 | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P817ZP3.5 | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P817ZP3.5R | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P817ZP3R | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P818 | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P818ZP3.5 | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM | |
MCM69P818ZP3.5R | MOTOROLA |
获取价格 |
256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM |