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MCIMX6D6AYM08AC

更新时间： 2024-11-05 02:11:07
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恩智浦 - NXP /
页数 文件大小 规格书
162页 2579K
描述
i.MX 6Dual/6Quad Applications Processors for Industrial Products

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Document Number: IMX6DQIEC  
Rev. 6, 11/2018  
NXP Semiconductors  
Data Sheet: Technical Data  
MCIMX6QxCxxxxC  
MCIMX6QxCxxxxD  
MCIMX6QxCxxxxE  
MCIMX6DxCxxxxC  
MCIMX6DxCxxxxD  
MCIMX6DxCxxxxE  
i.MX 6Dual/6Quad  
ApplicationsProcessorsfor  
Industrial Products  
Package Information  
FCPBGA Package  
21 x 21 mm, 0.8 mm pitch  
Ordering Information  
See Table 1  
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 7  
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 17  
3.2 Recommended Connections for Unused Analog  
Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
1 Introduction  
The i.MX 6Dual/6Quad processors represent the latest  
achievement in integrated multimedia applications  
processors. These processors are part of a growing  
family of multimedia-focused products that offer high  
performance processing and are optimized for lowest  
2
3
power consumption.  
4
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 18  
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 18  
4.2 Power Supplies Requirements and Restrictions . . 31  
4.3 Integrated LDO Voltage Regulator Parameters . . 32  
4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 34  
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 35  
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36  
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 41  
4.8 Output Buffer Impedance Parameters. . . . . . . . . . 45  
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 48  
4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 60  
4.11 General-Purpose Media Interface (GPMI) Timing. 60  
4.12 External Peripheral Interface Parameters . . . . . . . 69  
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 130  
5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 130  
5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 131  
Package Information and Contact Assignments. . . . . . 133  
6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 133  
6.2 21 x 21 mm Package Information . . . . . . . . . . . . 133  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156  
The i.MX 6Dual/6Quad processors feature advanced  
®
®
implementation of the quad Arm Cortex -A9 core,  
which operates at speeds up to 800 MHz. They include  
2D and 3D graphics processors, 1080p video processing,  
and integrated power management. Each processor  
provides a 64-bit DDR3/DDR3L/LPDDR2-800 memory  
interface and a number of other interfaces for connecting  
®
peripherals, such as WLAN, Bluetooth , GPS, hard  
drive, displays, and camera sensors.  
5
6
7
NXP Reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  
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