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MCIMX35SR2CEC

更新时间: 2024-11-06 02:52:55
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恩智浦 - NXP /
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147页 2175K
描述
i.MX35 Applications Processors for Industrial and Consumer Products

MCIMX35SR2CEC 数据手册

 浏览型号MCIMX35SR2CEC的Datasheet PDF文件第2页浏览型号MCIMX35SR2CEC的Datasheet PDF文件第3页浏览型号MCIMX35SR2CEC的Datasheet PDF文件第4页浏览型号MCIMX35SR2CEC的Datasheet PDF文件第5页浏览型号MCIMX35SR2CEC的Datasheet PDF文件第6页浏览型号MCIMX35SR2CEC的Datasheet PDF文件第7页 
Freescale Semiconductor  
Data Sheet: Technical Data  
Document Number: MCIMX35SR2CEC  
Rev. 10, 06/2012  
IMX35  
Package Information  
Plastic Package  
Case 5284 17 x 17 mm, 0.8 mm Pitch  
i.MX35 Applications  
Processors for  
Ordering Information  
Industrial and  
See Table 1 on page 3 for ordering information.  
Consumer Products  
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1 Introduction  
The i.MX353 and the i.MX357 multimedia applications  
processors represent the next generation of ARM11  
products with the right performance and integration to  
address applications within the industrial and consumer  
markets for applications such as HMI and display  
controllers. Unless otherwise specified, the material in  
this data sheet is applicable to both the i.MX353 and  
i.MX357 devices and referred to singularly throughout  
this document as i.MX35 or MCIMX35. The i.MX353  
devices do not include a graphics processing unit  
(GPU). For information on i.MX35 devices for  
automotive applications, please refer to document  
number, MCIMX35SR2AEC.  
2
Functional Description and Application Information. . . . . . 4  
2.1. Application Processor Domain Overview. . . . . . . . . 5  
2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6  
2.3. Advanced Power Management Overview . . . . . . . . 6  
2.4. ARM11 Microprocessor Core. . . . . . . . . . . . . . . . . . 6  
2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3. Signal Descriptions: Special Function Related Pins . . . . 12  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12  
4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 12  
4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
4.3. Supply Power-Up/Power-Down Requirements and  
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18  
4.6. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 19  
4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . . 20  
4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . . 23  
4.9. Module-Level AC Electrical Specifications. . . . . . . 29  
5. Package Information and Pinout . . . . . . . . . . . . . . . . . . 130  
5.1. MAPBGA Production Package 1568-01, 17 × 17 mm,  
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131  
The i.MX35 processor takes advantage of the  
ARM1136JF-S™ core running at 532 MHz that is  
boosted by a multi-level cache system and integrated  
features such as LCD controller, Ethernet, and graphics  
acceleration for creating rich user interfaces.  
5.2. MAPBGA Signal Assignments. . . . . . . . . . . . . . . 132  
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . 144  
7. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145  
The i.MX35 supports connections to various types of  
external memories, such as SDRAM, mobile DDR, and  
DDR2, SLC and MCL NAND Flash, NOR Flash and  
© Freescale Semiconductor, Inc., 2010. All rights reserved.  

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SPECIALTY MICROPROCESSOR CIRCUIT, PBGA416, 13 X 13 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLAS