是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIE | 包装说明: | DIE, FLIP CHIP |
针数: | 10 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.1 |
Is Samacsys: | N | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | R-XUUC-N10 | JESD-609代码: | e0 |
端子数量: | 10 | 最高工作温度: | 170 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | DIE | 封装等效代码: | FLIP CHIP |
封装形状: | RECTANGULAR | 封装形式: | UNCASED CHIP |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 12 V |
认证状态: | Not Qualified | 子类别: | Automotive Circuits |
最大供电电流 (Isup): | 25 mA | 标称供电电压 (Vsup): | 12 V |
表面贴装: | YES | 技术: | BIPOLAR |
温度等级: | AUTOMOTIVE | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | NO LEAD | 端子位置: | UPPER |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | Base Number Matches: | 1 |
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