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MCCF33095 PDF预览

MCCF33095

更新时间: 2024-11-25 22:31:23
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 调节器模拟IC信号电路电机LTE
页数 文件大小 规格书
12页 169K
描述
INTEGRAL ALTERNATOR REGULATOR

MCCF33095 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIE包装说明:DIE, FLIP CHIP
针数:10Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.1
Is Samacsys:N模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-XUUC-N10JESD-609代码:e0
端子数量:10最高工作温度:170 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:DIE封装等效代码:FLIP CHIP
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED电源:12 V
认证状态:Not Qualified子类别:Automotive Circuits
最大供电电流 (Isup):25 mA标称供电电压 (Vsup):12 V
表面贴装:YES技术:BIPOLAR
温度等级:AUTOMOTIVE端子面层:Tin/Lead (Sn/Pb)
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

MCCF33095 数据手册

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Order this document by MCCF33095/D  
The MCCF33095 (Flip–Chip) and MC33095 (Surface Mount) are  
regulator control integrated circuits designed for use in automotive 12 V  
alternator charging systems. Few external components are required for full  
system implementation. These devices provide control for a broad range of  
12 V alternator charging systems when used in conjunction with the  
appropriate Motorola Power Darlington transistor to control the field current  
of the specific alternator.  
Both versions have internal detection and protection features to withstand  
extreme electrical variations encountered in harsh automotive environments.  
Flip–Chip Technology allows the MCCF33095 to operate at higher ambient  
temperatures than the surface mount version in addition to withstanding  
severe vibration and thermal shock with a high degree of reliability.  
INTEGRAL  
ALTERNATOR  
REGULATOR  
SEMICONDUCTOR  
TECHNICAL DATA  
3
2
1
Constant Frequency with Variable Duty Cycle Operation  
10  
9
Adjusts System Charging to Compensate for Changes  
4
in Ambient Temperature  
Slew Rate Control to Reduce EMI  
Lamp Pin to Indicate Abnormal Operating Conditions  
Shorted Field Protection  
5
6
7
8
FLIP–CHIP CONFIGURATION  
(Backside View)  
Back marking is oriented as shown  
Resumes Normal Operation Once Fault Condition Ceases  
Operation from 40°C to 170°C for Flip–Chip and 40°C to 125°C  
for SO–14  
Surface Mount or Solder Bump Processed Flip–Chip Assembly Versions  
14  
1
Simplified Block Diagram  
D SUFFIX  
PLASTIC PACKAGE  
CASE 751A  
V
CC  
1 (12)  
(SO–14)  
4 (8)  
Ignition  
Series  
Regulator  
Load Dump  
Detection and  
Protection  
+
Bump  
Function  
SO–14 (Note 1)  
(12)  
(11)  
(10)  
(8)  
(5)  
(4)  
1
2
3
4
5
6
7
8
9
V
CC  
Sense  
Stator  
Ignition  
Lamp  
Oscillator  
Roll–Off  
Ground  
+
6 (4)  
Oscillator  
Oscillator  
9 (1)  
Darlington  
Drive  
S
R
S
R
2 (11)  
Sense  
Q
Q
(3)(Note 2)  
(2)  
(1)  
(14)  
Darlington Drive  
Short Circuit  
V
Reg  
10  
10 (14)  
Short  
Circuit  
Timer  
7 (3)  
Roll–Off  
Thermal  
Protection  
NOTES: 1. No connections to Pins 3, 6, 7, 9 and 13.  
2. Connected to ground internal to package.  
5 (5)  
Lamp  
V
HV  
3 (10)  
Stator  
One  
Shot  
ORDERING INFORMATION  
Operating  
Temperature Range  
Device  
Package  
8 (2)  
MCCF33095 T = 40° to +170°C  
Flip–Chip  
SO–14  
A
Ground  
MC33095D  
T = 40° to +125°C  
A
This device contains 145 active transistors.  
This document contains information on a new product. Specifications and information herein  
are subject to change without notice.  
Motorola, Inc. 1996  
Rev 1  

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