MCAC95N06Y
Features
•
•
•
Split Gate Trench MOSFET Technology
Excellent Package for Heat Dissipation
High Density Cell Design for Low RDS(on)
•
•
•
•
Epoxy Meets UL 94 V-0 Flammability Rating
Moisture Sensitivity Level 1
N-CHANNEL
MOSFET
Halogen Free. “Green” Device (Note 1)
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
Maximum Ratings
•
•
Operating Junction Temperature Range : -55°C to +150°C
Storage Temperature Range: -55°C to +150°C
DFN5060
•
•
Thermal Resistance: 20°C/W Junction to Ambient(Note 2)
Thermal Resistance: 1.04°C/W Junction to Case
Parameter
Rating
60
Symbol
VDS
Unit
V
D
H
B
Drain-Source Voltage
Gate-Source Volltage
A
N
•
VGS
±20
95
V
PIN 1
G
C
J
TC=25°C
A
Continuous Drain
Current(Note 3)
ID
TC=100°C
60
A
E
Pulsed Drain Current (Note 4)
Avalanche Energy(Note 5)
Total Power Dissipation (Note 6)
Note:
IDM
EAS
PD
390
500
120
A
F
mJ
W
K
M
L
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
2. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz.
DIMENSIONS
MM
MIN MAX MIN MAX
0.031 0.047 0.80 1.20
copper, in a still air environment with TA=25°C.
INCHES
3. The maximum current rating is package limited.
DIM
NOTE
TYP.
4. Repetitive rating; pulse width limited by max. junction temperature.
A
B
C
D
E
F
G
H
K
J
5. VDD=50V, RG=25Ω, L=0.5mH, starting TJ=25°C.
0.010
0.254
6. P is based on max. junction temperature, using junction-case thermal resistance.
0.193 0.222 4.90 5.64
0.232 0.250 5.90 6.35
0.148 0.167 3.75 4.25
0.126 0.154 3.20 3.92
0.189 0.213 4.80 5.40
0.222 0.239 5.65 6.06
0.045 0.059 1.15 1.50
0.012 0.020 0.30 0.50
0.046 0.054 1.17 1.37
0.012 0.028 0.30 0.71
0.016 0.028 0.40 0.71
D
Internal Structure and Marking Code
8
7
6
5
D
D
D
D
8
7
6
5
MCC
MCAC95N06Y
L
M
N
1
2
3
4
S
S
S
G
1
2
3
4
Rev.3-5-04092022
1/5
MCCSEMI.COM