MCAC014N10Y
Features
•
•
•
•
•
•
Split Gate Trench MOSFET Tenchnology
Excellent Package For Heat Dissipation
Moisture Sencitivity Level 1
Halogen Free. “Green” Device (Note 1)
Epoxy Meets UL 94 V-0 Flammability Rating
N-Channel
MOSFET
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
Maximum Ratings
•
•
Operating Junction Temperature Range: -55°C to +150°C
Storage Temperature Range: -55°C to +150°C
•
•
Thermal Resistance: 50°C/W Junction to Ambient(Note 2)
Thermal Resistance: 1.2°C/W Junction to Case
DFN5060
Parameter
Rating
100
±20
60
Symbol
VDS
Unit
V
Drain-Source Voltage
Gate-Source Volltage
VGS
V
TC=25°C
D
H
B
ID
A
Continuous Drain Current
A
N
38
TC=100°C
•
Pulsed Drain Current(Note 3)
Total Power Dissipation(Note 4)
IDM
PD
240
104
A
W
PIN 1
G
J
C
Single Pulsed Avalanche Energy(Note 5)
EAS
mJ
81
E
F
Note:
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,
K
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
M
2. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz.
Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on
RθJA t≤ 10s and the maximum allowed junction temperature of 150°C. The value in any
given application depends on the user's specific board design.
L
3. Repetitive rating; pulse width limited by max. junction temperature.
4. PD is based on max. junction temperature, using junction-case thermal resistance.
5. TJ=25℃, VDD=50V, VGS=10V, RG=25Ω, L=2mH.
DIMENSIONS
INCHES
MM
DIM
NOTE
TYP.
MIN MAX MIN MAX
0.031 0.047 0.80 1.20
A
B
C
D
E
F
G
H
K
J
0.010
0.254
0.193 0.222 4.90 5.64
0.232 0.250 5.90 6.35
0.148 0.167 3.75 4.25
0.126 0.154 3.20 3.92
0.189 0.213 4.80 5.40
0.222 0.239 5.65 6.06
0.045 0.059 1.15 1.50
0.012 0.020 0.30 0.50
0.046 0.054 1.17 1.37
0.012 0.028 0.30 0.71
0.016 0.028 0.40 0.71
Internal Structure and Marking Code
8
7
6
5
D
D
D
D
8
7
6
5
MCC
MCAC014N10Y
L
M
N
1
2
3
4
S
S
S
G
1
2
3
4
Rev.4.1-12222023
1/6
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