是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | 针数: | 1023 |
Reach Compliance Code: | not_compliant | ECCN代码: | 3A991.A.1 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.37 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 1000 MHz |
外部数据总线宽度: | 32 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-CBGA-B1023 |
JESD-609代码: | e2 | 长度: | 33 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 1023 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | BGA | 封装等效代码: | BGA1023,32X32,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 245 | 电源: | 1.1,1.8/2.5,2.5/3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 2.77 mm |
速度: | 166.66 MHz | 子类别: | Microprocessors |
最大供电电压: | 1.1 V | 最小供电电压: | 1 V |
标称供电电压: | 1.05 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver (Sn/Ag) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 33 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MC8641DVU1000H | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DVU1000J | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DVU1000JC | NXP |
获取价格 |
32-BIT, 1000MHz, MICROPROCESSOR, CBGA1023 | |
MC8641DVU1000K | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DVU1000N | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DVU1000NC | NXP |
获取价格 |
32-BIT, 166.66MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | |
MC8641DVU1000NE | NXP |
获取价格 |
32-Bit Power Architecture SoC, 2 X 1000MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, | |
MC8641DVU1250G | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DVU1250GB | NXP |
获取价格 |
MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | |
MC8641DVU1250GC | NXP |
获取价格 |
MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 |