MC54/74HC393
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE Y
14
1
8
7
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
-B-
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.785
0.280
0.200
0.020
0.065
MIN
19.05
6.23
3.94
0.39
1.40
MAX
19.94
7.11
5.08
0.50
1.65
0.750
0.245
0.155
0.015
0.055
-T-
SEATING
PLANE
K
G
J
K
L
M
N
0.100 BSC
2.54 BSC
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
M
F
G
N
D 14 PL
0.25 (0.010)
J 14 PL
0.300 BSC
15
0.040
7.62 BSC
15
0.51 1.01
0°
°
0°
°
M
M
S
S
T
A
0.25 (0.010)
T
B
0.020
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
ISSUE L
14
1
8
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
7
INCHES
MILLIMETERS
A
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
0.715
0.240
0.145
0.015
0.040
F
L
C
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
7.62 BSC
SEATING
PLANE
K
0
10
0
10
0.015
0.039
0.39
1.01
H
G
D
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ISSUE F
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
14
1
8
P 7 PL
–B–
M
M
0.25 (0.010)
B
7
MILLIMETERS
INCHES
G
F
R X 45°
DIM
A
B
C
D
F
G
J
MIN
8.55
3.80
1.35
0.35
0.40
MAX
8.75
4.00
1.75
0.49
1.25
MIN
MAX
0.344
0.157
0.068
0.019
0.049
C
0.337
0.150
0.054
0.014
0.016
J
M
SEATING
PLANE
K
D 14 PL
0.25 (0.010)
1.27 BSC
0.050 BSC
0.19
0.10
0.25
0.25
0.008
0.004
0.009
0.009
M
S
S
T
B
A
K
M
P
R
0
5.80
0.25
°
7
6.20
0.50
°
0
°
7°
0.244
0.019
0.228
0.010
MOTOROLA
6
High–Speed CMOS Logic Data
DL129 — Rev 6