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MC75172BDWR2 PDF预览

MC75172BDWR2

更新时间: 2024-11-25 04:16:27
品牌 Logo 应用领域
安森美 - ONSEMI 线路驱动器或接收器驱动程序和接口接口集成电路光电二极管
页数 文件大小 规格书
13页 122K
描述
Quad EIA−485 Line Drivers with Three−State Outputs

MC75172BDWR2 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:PLASTIC, SOIC-20针数:20
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.21
Is Samacsys:N差分输出:YES
驱动器位数:4高电平输入电流最大值:0.00002 A
输入特性:STANDARD接口集成电路类型:LINE DRIVER
接口标准:V.11; X.27; EIA-422-A; EIA-485JESD-30 代码:R-PDSO-G20
JESD-609代码:e0长度:12.8 mm
湿度敏感等级:1功能数量:4
端子数量:20最高工作温度:85 °C
最低工作温度:-40 °C最小输出摆幅:1.5 V
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP20,.4
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240电源:5 V
认证状态:Not Qualified最大接收延迟:
座面最大高度:2.65 mm子类别:Line Driver or Receivers
最大供电电压:5.25 V最小供电电压:4.75 V
标称供电电压:5 V表面贴装:YES
技术:BIPOLAR温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30最大传输延迟:25 ns
宽度:7.5 mmBase Number Matches:1

MC75172BDWR2 数据手册

 浏览型号MC75172BDWR2的Datasheet PDF文件第2页浏览型号MC75172BDWR2的Datasheet PDF文件第3页浏览型号MC75172BDWR2的Datasheet PDF文件第4页浏览型号MC75172BDWR2的Datasheet PDF文件第5页浏览型号MC75172BDWR2的Datasheet PDF文件第6页浏览型号MC75172BDWR2的Datasheet PDF文件第7页 
MC75172B, MC75174B  
Quad EIA−485 Line Drivers  
with Three−State Outputs  
The ON Semiconductor MC75172B/174B Quad Line drivers are  
differential high speed drivers designed to comply with the EIA−485  
Standard. Features include three−state outputs, thermal shutdown, and  
output current limiting in both directions. These devices also comply  
with EIA−422−A, and CCITT Recommendations V.11 and X.27.  
The MC75172B/174B are optimized for balanced multipoint bus  
transmission at rates in excess of 10 MBPS. The outputs feature wide  
common mode voltage range, making them suitable for party line  
applications in noisy environments. The current limit and thermal  
shutdown features protect the devices from line fault conditions.  
These devices offer optimum performance when used with the  
MC75173 and MC75175 line receivers.  
http://onsemi.com  
QUAD EIA−485 LINE DRIVERS  
SOIC−20 WB  
DW SUFFIX  
Both devices are available in 16−pin plastic PDIP and 20−pin wide  
body surface mount packages.  
CASE 751D  
1
Features  
Meets EIA−485 Standard for Party Line Operation  
Meets EIA−422−A and CCITT Recommendations V.11 and X.27  
Operating Ambient Temperature: −40°C to +85°C  
High Impedance Outputs  
PDIP−16  
P SUFFIX  
CASE 648  
1
Common Mode Output Voltage Range: −7.0 to 12 V  
Positive and Negative Current Limiting  
Transmission Rates in Excess of 10 MBPS  
Thermal Shutdown at 150°C Junction Temperature, ( 20°C)  
Single 5.0 V Supply  
MARKING DIAGRAMS  
Pin Compatible with TI SN75172/4 and NS mA96172/4  
20  
Interchangeable with MC3487 and AM26LS31 for EIA−422−A  
Applications  
MC17517xBDW  
AWLYYWWG  
Pb−Free Packages are Available*  
MAXIMUM RATING  
1
Rating  
Power Supply Voltage  
Symbol  
Value  
−0.5, +7.0  
+7.0  
Unit  
Vdc  
Vdc  
mA  
V
CC  
16  
Input Voltage (Data, Enable)  
V
in  
MC75174BP  
AWLYYWWG  
Input Current (Data, Enable)  
I
in  
−24  
Applied Output Voltage, when in 3−State  
V
za  
−10, +14  
Vdc  
1
Condition (V = 5.0 V)  
CC  
Applied Output Voltage, when V = 0 V  
V
14  
Vdc  
CC  
zb  
O
x
= 2 or 4  
Output Current  
I
Self−Limiting  
−65, +150  
A
= Assembly Location  
Storage Temperature  
T
stg  
°C  
WL = Wafer Lot  
YY = Year  
WW = Work Week  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
RecommendedOperating Conditions may affect device reliability.  
G
= Pb−Free Package  
1. Devices should not be operated at these limits. The “Recommended Operating  
Conditions” table provides for actual device operation.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 11 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference  
Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
July, 2006 − Rev. 4  
MC75172B/D  

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